BCW30LT1G

更新时间： 2024-01-03 23:38:28

品牌	Logo	应用领域
安森美 - ONSEMI		晶体小信号双极晶体管光电二极管
页数	文件大小	规格书
7页	237K
描述
General Purpose Transistors

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技术参数
数据手册

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BCW30LT1G 技术参数

生命周期：	Contact Manufacturer	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.61
最大集电极电流 (IC)：	0.1 A	配置：	Single
最小直流电流增益 (hFE)：	215	最高工作温度：	150 °C
极性/信道类型：	PNP	最大功率耗散 (Abs)：	0.225 W
子类别：	Other Transistors	表面贴装：	YES
Base Number Matches：	1

BCW30LT1G 数据手册

BCW30LT1G

General Purpose

Transistors

PNP Silicon

http://onsemi.com

Features

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

COLLECTOR

Compliant

BASE

MAXIMUM RATINGS

Rating

Symbol

Value

−32

Unit

Vdc

EMITTER

Collector − Emitter Voltage

Collector − Base Voltage

Emitter-Base Voltage

CEO

CBO

−32

Vdc

EBO

−5.0

−100

Vdc

Collector Current − Continuous

mAdc

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

SOT−23 (TO−236AB)

CASE 318−08

STYLE 6

Total Device Dissipation

FR-5 Board (Note 1)

T = 25°C

225

Derate above 25°C

1.8

mW/°C

°C/W

Thermal Resistance,

556

MARKING DIAGRAM

Junction−to−Ambient

Total Device Dissipation

Alumina Substrate (Note 2)

300

C2 M G

T = 25°C

Derate above 25°C

2.4

mW/°C

°C/W

= Specific Device Code

= Date Code*

= Pb−Free Package

Thermal Resistance,

Junction−to−Ambient

417

Junction and Storage Temperature

T , T

−55 to +150

°C

stg

(Note: Microdot may be in either location)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 ꢀ 0.75 ꢀ 0.062 in.

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

2. Alumina = 0.4 ꢀ 0.3 ꢀ 0.024 in. 99.5% alumina.

ORDERING INFORMATION

Device

Package

Shipping

BCW30LT1G

SOT−23

3000/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2009

Publication Order Number:

August, 2009 − Rev. 2

BCW30LT1/D

12 3 4 5 6 7

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