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BAS40-04TP PDF预览

BAS40-04TP

更新时间: 2024-09-13 13:05:51
品牌 Logo 应用领域
美微科 - MCC 肖特基二极管光电二极管IOT
页数 文件大小 规格书
4页 263K
描述
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BAS40-04TP 数据手册

 浏览型号BAS40-04TP的Datasheet PDF文件第2页浏览型号BAS40-04TP的Datasheet PDF文件第3页浏览型号BAS40-04TP的Datasheet PDF文件第4页 
M C C  
BAS40  
THRU  
BAS70  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Surface Mount  
Schottky Barrier Diode  
200 mWatt  
SOT-23 Package For surface mount application  
Protects from line to VCC and line to ground  
Low forward voltage and reverse recovery characteristics  
Bidirectional-low-forward available with “ -04” suffix (Figure 2)  
Tape & Reel EIA Standard 481.  
Mechanical Data  
SOT-23  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
A
D
Mounting Position: Any  
Weight: .008 grams (approx.)  
B
C
MAXIMUM RATINGS  
Operating Temperature: -55oC to +125oC  
Storage Temperature: -55oC to +150oC  
Power Dissipation: 200 mWatts @ Tamb=25oC  
F
E
H
G
J
o
a =25 C  
o
@
T
BAS40 IFM =200mA  
Forward Continuous Current:  
Surge Forward Current: 600mA @ tp<1s, Tamb=25oC  
@
T
I
=70mA  
a =25 C  
BAS70  
FM  
K
DIMENSIONS  
MM  
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
DESCRIPTION  
Various configurations of Schottky barrier’ s diodes in SOT-23  
package are provided for general-purpose use in high-speed  
switching ,mixers and detector applications. They may also be  
used for signal integrity and counteract the transmission-line  
effects with (PC) board trances by clamping over/and undershoot  
from signal reflections with the schottky-low-threshold voltages.  
This type of termination also does not depend on matching  
the transmission line characteristic impedance, making it  
particularly useful where line impendance is unknown or a  
variable. This methode of termination can control distortions of  
clock, data, address, and control lines as well as provides a  
stabilizing effect on signal jitter. It can also significantly reduce  
power consumption compared to standard resistor-based  
termination methods.  
F
G
H
J
.085  
.37  
K
Suggested Solder  
Pad Layout  
.031  
.800  
.035  
.900  
.079  
inches  
mm  
2.000  
.037  
.950  
.037  
.950  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 4  

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