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AVCE6467T

更新时间： 2022-04-26 09:22:47

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德州仪器 - TI		/
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VCE6467T, AVCE6467T Digital Media System-on-Chip

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AVCE6467T 数据手册

VCE6467T, AVCE6467T

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SPRS690–MARCH 2011

7 Mechanical Packaging and Orderable Information

The following table(s) show the thermal resistance characteristics for the PBGA–ZUT mechanical

package.

7.1 Thermal Data for ZUT

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]

NO.

°C/W⁽¹⁾

1.5

AIR FLOW (m/s)⁽²⁾

RΘ_JC

RΘ_JB

RΘ_JA

Junction-to-case

Junction-to-board

Junction-to-free air

N/A

9.9

19.2

14.8

13.8

12.7

11.9

0.3

0.00

0.50

1.00

2.00

3.00

0.00

0.50

1.00

2.00

3.00

0.00

0.50

1.00

2.00

3.00

RΘ_JMA

Junction-to-moving air

0.4

Psi_JT

Junction-to-package top

0.4

0.5

9.0

8.0

Psi_JB

Junction-to-board

7.7

7.3

7.0

(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages.

(2) m/s = meters per second

7.2 Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

Mechanical Packaging and Orderable Information

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