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AVCE6467T

更新时间: 2024-10-28 12:21:31
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VCE6467T, AVCE6467T Digital Media System-on-Chip

AVCE6467T 数据手册

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VCE6467T, AVCE6467T  
www.ti.com  
SPRS690MARCH 2011  
7 Mechanical Packaging and Orderable Information  
The following table(s) show the thermal resistance characteristics for the PBGA–ZUT mechanical  
package.  
7.1 Thermal Data for ZUT  
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]  
NO.  
1
°C/W(1)  
1.5  
AIR FLOW (m/s)(2)  
RΘJC  
RΘJB  
RΘJA  
Junction-to-case  
Junction-to-board  
Junction-to-free air  
N/A  
N/A  
2
9.9  
3
19.2  
14.8  
13.8  
12.7  
11.9  
0.3  
0.00  
0.50  
1.00  
2.00  
3.00  
0.00  
0.50  
1.00  
2.00  
3.00  
0.00  
0.50  
1.00  
2.00  
3.00  
4
5
RΘJMA  
Junction-to-moving air  
6
7
8
9
0.4  
10  
11  
12  
13  
14  
15  
16  
17  
PsiJT  
Junction-to-package top  
0.4  
0.4  
0.5  
9.0  
8.0  
PsiJB  
Junction-to-board  
7.7  
7.3  
7.0  
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.  
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment  
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount  
Packages.  
(2) m/s = meters per second  
7.2 Packaging Information  
The following packaging information and addendum reflect the most current data available for the  
designated device(s). This data is subject to change without notice and without revision of this document.  
Copyright © 2011, Texas Instruments Incorporated  
Mechanical Packaging and Orderable Information  
Submit Documentation Feedback  
Product Folder Link(s): VCE6467T AVCE6467T  
349  

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