是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FLANGE MOUNT, R-XUFM-X10 | 针数: | 12 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 5.73 | 外壳连接: | ISOLATED |
最大集电极电流 (IC): | 50 A | 集电极-发射极最大电压: | 600 V |
配置: | COMPLEX | 门极-发射极最大电压: | 20 V |
JESD-30 代码: | R-XUFM-X10 | 元件数量: | 4 |
端子数量: | 10 | 最高工作温度: | 175 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 90 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
晶体管应用: | POWER CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 310 ns | 标称接通时间 (ton): | 170 ns |
VCEsat-Max: | 1.9 V | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT30TL601G-Module | MICROCHIP |
获取价格 |
Configuration: Three level inverterVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 30Silic | |
APTGT30TL60T3G | MICROSEMI |
获取价格 |
Three level inverter Trench + Field Stop IGBT Power Module | |
APTGT30X60T3G | MICROSEMI |
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3 Phase bridge Trench + Field Stop IGBT® Powe | |
APTGT30X60T3G-Module | MICROCHIP |
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Configuration: Three Phase bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 30Silicon | |
APTGT35A120D1 | ADPOW |
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Phase leg Trench IGBT Power Module | |
APTGT35A120T1G | MICROSEMI |
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Phase leg Fast Trench + Field Stop IGBT® Powe | |
APTGT35A120T1G-Module | MICROCHIP |
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Configuration: Phase legVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 35Silicon type: T | |
APTGT35DA120D1 | ADPOW |
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Boost chopper Trench IGBT® Power Module | |
APTGT35DA120D1G | MICROSEMI |
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Insulated Gate Bipolar Transistor, 55A I(C), 1200V V(BR)CES, N-Channel, MODULE-7 | |
APTGT35H120T1G | MICROSEMI |
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Full - Bridge Fast Trench + Field Stop IGBT� Power Module |