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5STB13N6500 PDF预览

5STB13N6500

更新时间: 2024-01-20 14:07:08
品牌 Logo 应用领域
ABB /
页数 文件大小 规格书
7页 495K
描述
Bi-Directional Control Thyristor

5STB13N6500 技术参数

生命周期:ActiveReach Compliance Code:compliant
HTS代码:8541.30.00.80风险等级:5.73
配置:SINGLE最大直流栅极触发电流:400 mA
最大直流栅极触发电压:2.6 V快速连接描述:0
螺丝端子的描述:0最大维持电流:300 mA
JESD-30 代码:O-CEDB-X6通态非重复峰值电流:2400 A
元件数量:1端子数量:6
最大通态电流:1400000 A最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:ROUND封装形式:DISK BUTTON
认证状态:Not Qualified最大均方根通态电流:2182 A
重复峰值反向电压:5600 V子类别:Silicon Controlled Rectifiers
表面贴装:YES端子形式:UNSPECIFIED
端子位置:END触发设备类型:TRIAC
Base Number Matches:1

5STB13N6500 数据手册

 浏览型号5STB13N6500的Datasheet PDF文件第2页浏览型号5STB13N6500的Datasheet PDF文件第3页浏览型号5STB13N6500的Datasheet PDF文件第4页浏览型号5STB13N6500的Datasheet PDF文件第5页浏览型号5STB13N6500的Datasheet PDF文件第6页浏览型号5STB13N6500的Datasheet PDF文件第7页 
VSM  
IT(AV)M  
IT(RMS)  
ITSM  
VT0  
=
=
=
6500 V  
1405 A  
2205 A  
Bi-Directional Control Thyristor  
= 22×103 A  
5STB 13N6500  
=
=
1.2 V  
0.6  
rT  
mW  
Doc. No. 5SYA1035-03 May 06  
·
·
·
·
·
Two thyristors integrated into one wafer  
Patented free-floating silicon technology  
Designed for energy management and industrial applications  
Optimum power handling capability  
Interdigitated amplifying gate.  
The electrical and thermal data are valid for one-thyristor-half of the device (unless otherwise stated)  
Blocking  
Maximum rated values Note 1  
Parameter  
Symbol Conditions  
min  
typ  
max  
6500  
Unit  
1)  
Max. surge peak blocking  
voltage  
VSM  
f = 5 Hz, tp = 10 ms  
V
1)  
Max. repetitive peak  
reverse blocking voltage  
VRM  
f = 50 Hz, tp = 10 ms  
5600  
2000  
V
Critical rate of rise of  
commutating voltage  
dv/dtcrit Exp. to 3750 V, Tvj = 125°C  
V/ms  
Characteristic values  
Parameter  
Symbol Conditions  
min  
typ  
typ  
max  
400  
Unit  
mA  
Max. leakage current  
IRM  
VRM, Tvj = 125 °C  
1) VRM is equal to VSM up to Tvj = 110 °C; de-rating of 0.11% per °C applicable for Tj below +5 °C  
Mechanical data  
Maximum rated values Note 1  
Parameter  
Symbol Conditions  
min  
81  
max  
Unit  
kN  
m/s2  
m/s2  
Mounting force  
Acceleration  
FM  
90  
108  
50  
a
a
Device unclamped  
Device clamped  
Acceleration  
100  
Characteristic values  
Parameter  
Symbol Conditions  
min  
35  
typ  
max  
Unit  
Weight  
m
2.9  
kg  
Housing thickness  
H
FM = 90 kN, Ta = 25 °C  
35.6  
mm  
mm  
mm  
Surface creepage distance DS  
Air strike distance Da  
53  
22  
Note 1 Maximum rated values indicate limits beyond which damage to the device may occur  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  

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