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2SC3356R24-T1B PDF预览

2SC3356R24-T1B

更新时间: 2024-11-12 15:25:11
品牌 Logo 应用领域
日电电子 - NEC /
页数 文件大小 规格书
8页 99K
描述
UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, MINIMOLD PACKAGE-3

2SC3356R24-T1B 技术参数

生命周期:Transferred包装说明:MINIMOLD PACKAGE-3
Reach Compliance Code:unknown风险等级:5.82
最大集电极电流 (IC):0.1 A基于收集器的最大容量:1 pF
集电极-发射极最大电压:12 V配置:SINGLE
最高频带:ULTRA HIGH FREQUENCY BANDJESD-30 代码:R-PDSO-G3
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:NPN
认证状态:Not Qualified表面贴装:YES
端子形式:GULL WING端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):7000 MHz

2SC3356R24-T1B 数据手册

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DATA SHEET  
NPN SILICON RF TRANSISTOR  
2SC3356  
NPN EPITAXIAL SILICON RF TRANSISTOR  
FOR MICROWAVE LOW-NOISE AMPLIFICATION  
3-PIN MINIMOLD  
FEATURES  
Low noise and high gain : NF = 1.1 dB TYP., Ga = 11 dB TYP. @ VCE = 10 V, IC = 7 mA, f = 1 GHz  
High power gain : MAG = 13 dB TYP. @ VCE = 10 V, IC = 20 mA, f = 1 GHz  
ORDERING INFORMATION  
Part Number  
Quantity  
Supplying Form  
2SC3356  
50 pcs (Non reel)  
3 kpcs/reel  
• 8 mm wide embossed taping  
• Pin 3 (Collector) face the perforation side of the tape  
2SC3356-T1B  
Remark To order evaluation samples, contact your nearby sales office.  
The unit sample quantity is 50 pcs.  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)  
Parameter  
Collector to Base Voltage  
Collector to Emitter Voltage  
Emitter to Base Voltage  
Collector Current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
V
20  
12  
V
3.0  
V
100  
mA  
mW  
°C  
°C  
Note  
Total Power Dissipation  
Junction Temperature  
Storage Temperature  
Ptot  
200  
Tj  
150  
Tstg  
65 to +150  
Note Free air  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PU10209EJ02V0DS (2nd edition)  
Date Published June 2004 CP(K)  
Printed in Japan  
The mark  shows major revised points.  
NEC Compound Semiconductor Devices, Ltd.1985, 2004  

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