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2SC3325YTE85R PDF预览

2SC3325YTE85R

更新时间: 2024-11-13 21:00:51
品牌 Logo 应用领域
东芝 - TOSHIBA 开关光电二极管晶体管
页数 文件大小 规格书
4页 133K
描述
TRANSISTOR 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, BIP General Purpose Small Signal

2SC3325YTE85R 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-G3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.21.00.75风险等级:5.71
最大集电极电流 (IC):0.5 A集电极-发射极最大电压:50 V
配置:SINGLE最小直流电流增益 (hFE):40
JEDEC-95代码:TO-236JESD-30 代码:R-PDSO-G3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:NPN认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICON标称过渡频率 (fT):300 MHz
VCEsat-Max:0.25 VBase Number Matches:1

2SC3325YTE85R 数据手册

 浏览型号2SC3325YTE85R的Datasheet PDF文件第2页浏览型号2SC3325YTE85R的Datasheet PDF文件第3页浏览型号2SC3325YTE85R的Datasheet PDF文件第4页 
2SC3325  
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT process)  
2SC3325  
Audio Frequency Low Power Amplifier Applications  
Unit: mm  
Driver Stage Amplifier Applications  
Switching Applications  
Excellent h  
linearity: h  
= 25 (min) (V = 6 V, I = 400 mA)  
CE C  
FE  
FE (2)  
High voltage: V  
= 50 V (min)  
CEO  
Complementary to 2SA1313  
Small package  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
50  
50  
V
V
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
5
V
I
500  
50  
mA  
mA  
mW  
°C  
°C  
C
JEDEC  
JEITA  
TO-236MOD  
Base current  
I
B
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
200  
150  
55~150  
SC-59  
C
T
j
TOSHIBA  
2-3F1A  
T
stg  
Weight: 0.012 g (typ.)  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Marking  
1
2007-11-01  

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