2N5191G

更新时间： 2024-02-28 11:56:56

品牌	Logo	应用领域
安森美 - ONSEMI		晶体晶体管功率双极晶体管开关局域网
页数	文件大小	规格书
6页	90K
描述
Silicon NPN Power Transistors

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技术参数
数据手册

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2N5191G 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	,	Reach Compliance Code：	compliant
风险等级：	5.75	Is Samacsys：	N
JESD-609代码：	e3	峰值回流温度（摄氏度）：	NOT SPECIFIED
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

2N5191G 数据手册

2N5190, 2N5191, 2N5192

Silicon NPN Power

Transistors

Silicon NPN power transistors are for use in power amplifier and

switching circuits, — excellent safe area limits. Complement to PNP

2N5194, 2N5195.

http://onsemi.com

Features

• ESD Ratings: Machine Model, C; > 400 V

Human Body Model, 3B; > 8000 V

4.0 AMPERES

NPN SILICON

POWER TRANSISTORS

40, 60, 80 VOLTS − 40 WATTS

• Epoxy Meets UL 94 V−0 @ 0.125 in.

• Pb−Free Packages are Available*

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

TO−225AA

CASE 77

STYLE 1

Collector−Emitter Voltage

2N5190

2N5191

2N5192

Vdc

CEO

CBO

EBO

Collector−Base Voltage

2N5190

2N5191

2N5192

Vdc

Emitter−Base Voltage

Collector Current

Base Current

5.0

4.0

1.0

Vdc

Adc

MARKING DIAGRAM

Total Device Dissipation @ T = 25°C

320

mW/°C

YWW

Derate above 25°C

N519xG

Operating and Storage Junction

Temperature Range

T , T

–65 to +150

°C

stg

THERMAL CHARACTERISTICS

Characteristic

Year

Work Week

Symbol

Max

Unit

2N519x = Device Code

x = 0, 1, or 2

Thermal Resistance, Junction−to−Case

3.12

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

= Pb−Free Package

ORDERING INFORMATION

†

Device

Package

Shipping

2N5190

TO−225AA

500 Units/Box

2N5190G

TO−225AA

(Pb−Free)

2N5191

TO−225AA

500 Units/Box

2N5191G

TO−225AA

(Pb−Free)

2N5192

TO−225AA

500 Units/Box

2N5192G

TO−225AA

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

March, 2006 − Rev. 12

2N5191/D

12 3 4 5 6

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