XB1004-BD
Buffer Amplifier
16.0-30.0 GHz
Rev. V1
MTTF Tables
These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating
foundry.
Backplate Temperature
55 deg Celsius
Channel Temperature
83.4 deg Celsius
Rth
MTTF Hours
5.36E+10
FITs
78.8° C/W
84.7° C/W
90.0° C/W
1.87E-02
2.84E-01
3.13E+00
75 deg Celsius
105.5 deg Celsius
127.4 deg Celsius
3.52E+09
95 deg Celsius
3.206E+08
Bias Conditions: Vd1=Vd2=4.0V, Id1=45 mA, Id2=45 mA
Backplate Temperature
55 deg Celsius
Channel Temperature
108.3 deg Celsius
132.1 deg Celsius
155.5 deg Celsius
Rth
MTTF Hours
2.56E+09
FITs
76.1° C/W
81.5° C/W
86.4° C/W
3.91E-01
5.04E+00
4.72E+01
75 deg Celsius
1.992E+08
2.12E+07
95 deg Celsius
Bias Conditions: Vd1=Vd2=5.0V, Id1=70 mA, Id2=70 mA
Backplate Temperature
55 deg Celsius
Channel Temperature
138.1 deg Celsius
163.7 deg Celsius
188.8 deg Celsius
Rth
MTTF Hours
1.08E+08
FITs
77.0° C/W
82.1° C/W
86.8° C/W
9.22E-00
9.82E+01
7.73E+02
75 deg Celsius
1.02E+07
95 deg Celsius
1.29E+06
Bias Conditions: Vd1=Vd2=6.0V, Id1=90 mA, Id2=90 mA
9
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
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