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WTR03N039L PDF预览

WTR03N039L

更新时间: 2024-11-28 14:48:03
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
8页 512K
描述
功率金氧半电晶体

WTR03N039L 数据手册

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WTR03N039L-HAF  
N-Channel Enhancement Mode MOSFET  
Drain  
Features  
• Low RDS( ON )  
• Low Input Capacitance  
• Low Input/Output Leakage  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Gate  
1.Gate 2.Drain 3.Source  
TO-252 Plastic Package  
Source  
Application  
• Motor/Body Load Control  
• Load Switch  
• DC-DC converters and Off-line UPS  
Key Parameters  
Parameter  
BVDSS  
Value  
30  
Unit  
V
3.9 @ VGS = 10 V  
4.5 @ VGS = 4.5 V  
1.4  
RDS(ON) Max  
mΩ  
VGS(th) typ  
Qg typ  
V
74 @ VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Parameter Symbol  
Value  
30  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
± 20  
V
Tc = 25℃  
Tc = 100℃  
80  
50  
Continuous Drain Current  
ID  
A
Peak Drain Current, Pulsed 1)  
Avalanche Current  
IDM  
IAS  
350  
39  
A
A
Single Pulse Avalanche Energy 2)  
EAS  
76  
mJ  
Tc = 25℃  
Tc = 100℃  
41.6  
16.6  
Power Dissipation  
PD  
W
Operating Junction and Storage Temperature Range  
TJ, Tstg  
- 55 to + 150  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
3
Unit  
Thermal Resistance from Junction to Case  
/W  
/W  
Thermal Resistance from Junction to Ambient 3)  
RθJA  
35  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.  
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, ID = 39 A, VGS = 10 V.  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 8  
Dated: 02/12/2020 Rev: 01  

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