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WTR04P065LS-CH PDF预览

WTR04P065LS-CH

更新时间: 2024-11-07 14:54:31
品牌 Logo 应用领域
先科 - SWST 晶体
页数 文件大小 规格书
7页 571K
描述
功率金氧半电晶体

WTR04P065LS-CH 数据手册

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WTR04P065LS-CH  
P-Channel Enhancement Mode MOSFET  
Drain  
Features  
• AEC-Q101 Qualified  
• Low On-Resistance  
Gate  
• Surface-mounted package  
• Low Gate-Source Threshold Voltage  
• Halogen and Antimony Free(HAF),  
RoHS compliant  
Source  
1.Gate 2.Drain 3.Source  
TO-252 Plastic Package  
Key Parameters  
Parameter  
-BVDSS  
Value  
40  
Unit  
V
7.3 @ -VGS = 10 V  
10.5 @ -VGS = 4.5 V  
1.5  
RDS(ON) Max  
mΩ  
-VGS(th) typ  
Qg typ  
V
125 @ -VGS = 10 V  
nC  
Absolute Maximum Ratings (at Ta = 25unless otherwise specified)  
Parameter  
Symbol  
-VDS  
Value  
40  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
± 20  
V
Tc = 25°C  
Tc = 100°C  
71  
44  
Drain Current  
-ID  
A
Peak Drain Current, Pulsed 1)  
Single-Pulse Avalanche Current  
Single-Pulse Avalanche Energy 2)  
Power Dissipation  
-IDM  
-IAS  
300  
45  
A
A
EAS  
101  
mJ  
W
Tc = 25°C  
PD  
65.2  
Operating Junction and Storage Temperature Range  
TJ, Tstg  
- 55 to + 175  
Thermal Characteristics  
Parameter  
Symbol  
RθJC  
Max.  
2.3  
Unit  
/W  
/W  
Thermal Resistance from Junction to Case  
Thermal Resistance from Junction to Ambient 3)  
1) Pulse Test: Pulse Width 100 μs, Duty Cycle 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 175°C.  
2) Limited by TJ(MAX), starting TJ = 25°C, L = 0.1 mH, Rg = 25 Ω, -IAS = 45 A, VGS = 10 V.  
RθJA  
35  
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.  
®
1 / 7  
Dated: 13/06/2023 Rev: 02  

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