生命周期: | Active | 包装说明: | QFF, |
Reach Compliance Code: | compliant | 风险等级: | 5.55 |
最长访问时间: | 55 ns | 其他特性: | USER CONFIGURABLE AS 512K X 8 |
备用内存宽度: | 16 | JESD-30 代码: | S-CQFP-F68 |
长度: | 39.6 mm | 内存密度: | 4194304 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 128KX32 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | QFF |
封装形状: | SQUARE | 封装形式: | FLATPACK |
并行/串行: | PARALLEL | 座面最大高度: | 3.56 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | QUAD | 宽度: | 39.6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WS128K32N-55H1C | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-55H1CA | WEDC |
获取价格 |
SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
WS128K32N-55H1I | ETC |
获取价格 |
SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC | |
WS128K32N-55H1IA | MICROSEMI |
获取价格 |
SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
WS128K32N-55H1M | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-55H1MA | MICROSEMI |
获取价格 |
SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
WS128K32N-55H1MA | WEDC |
获取价格 |
SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
WS128K32N-55H1Q | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-55HI | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-55HIE | WEDC |
获取价格 |
SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP |