Datasheet > WS128K32N-55H1M

WS128K32N-55H1M

更新时间： 2024-11-04 23:42:59

品牌	Logo	应用领域
其他 - ETC		内存集成电路静态存储器
页数	文件大小	规格书
9页	160K
描述
x32 SRAM Module

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中文翻译

获取价格

数据手册

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WS128K32N-55H1M 数据手册

WS128K32-XXX

HI-RELIABILITY PRODUCT

128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595

FEATURES

■ Commercial, Industrial and Military Temperature

■ Access Times of 15, 17, 20, 25, 35, 45, 55ns

■ MIL-STD-883 Compliant Devices Available

■ Packaging

Ranges

■ 5 Volt Power Supply

■ Low Power CMOS

• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic

HIP (Package 400)

■ TTL Compatible Inputs and Outputs

• 68 lead, 40mm CQFP (G4T), 3.56mm (0.140")

(Package 502).

■ Built in Decoupling Caps and Multiple Ground Pins for

Low Noise Operation

• 68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),

(Package 509)

■ Weight:

WS128K32-XG1UX - 5 grams typical

WS128K32-XG2TX - 8 grams typical

WS128K32-XH1X - 13 grams typical

WS128K32-XG4TX - 20 grams typical

• 68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm

(0.140"), (Package 519)

■ Organized as 128Kx32; User Configurable as 256Kx16

■ All devices are upgradeable to 512Kx32

or 512Kx8

■ Low Power Data Retention - only available in G2T

package type

FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X

PIN DESCRIPTION

TOP VIEW

I/O0-31 Data Inputs/Outputs

A0-16

WE1-4

CS1-4

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

I/O

I/O15

I/O14

I/O13

I/O12

I/O24

I/O25

I/O26

I/O31

I/O30

I/O29

I/O28

I/O10

GND

I/O¹¹

VCC

A13

A14

A15

A16

I/O27

GND

A10

A11

A12

VCC

Not Connected

WE1

BLOCK DIAGRAM

I/O

I/O23

I/O22

I/O21

I/O20

WE₁CS₁

WE₂CS₂

WE₃CS₃

WE₄CS₄

0-16

I/O

I/O16

I/O17

I/O18

GND

I/O¹⁹

128K x 8

I/O16-23

I/O24-31

I/O0-7

I/O8-15

January 2001 Rev. 7

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...9

中文翻译

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与WS128K32N-55H1M相关器件

型号	品牌	获取价格	描述	数据表
WS128K32N-55H1MA	MICROSEMI	获取价格	SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS128K32N-55H1MA	WEDC	获取价格	SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS128K32N-55H1Q	ETC	获取价格	x32 SRAM Module
WS128K32N-55HI	ETC	获取价格	x32 SRAM Module
WS128K32N-55HIE	WEDC	获取价格	SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP
WS128K32N-55HM	ETC	获取价格	x32 SRAM Module
WS128K32N-55HQ	ETC	获取价格	x32 SRAM Module
WS128K32N-55HQE	WEDC	获取价格	SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP
WS128K32N-55HSC	WEDC	获取价格	SRAM Module, 512KX8, 55ns, CMOS, CHIP66,
WS128K32N-55HSI	WEDC	获取价格	SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP