WS128K32N-70G4M

更新时间： 2024-09-15 12:58:55

品牌	Logo	应用领域
WEDC		静态存储器
页数	文件大小	规格书
9页	379K
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中文翻译

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数据手册

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WS128K32N-70G4M 数据手册

WS128K32-XXX

White Electronic Designs

128Kx32 SRAM MODULE, SMD 5962-93187

FEATURES

ꢀ

Access Times of 70, 85, 100, 120ns

MIL-STD-883 Compliant Devices Available

Packaging

ꢀ

5 Volt Power Supply

Low Power CMOS

TTL Compatible Inputs and Outputs

Built in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

• 66-pin, PGA Type, 1.075 inch square, Hermetic

Ceramic HIP (Package 400).

• 68 lead, 40mm Low Proﬁle CQFP, 3.56mm

(0.140")(Package 502).

ꢀ

Weight

WS128K32-XG2UX - 8 grams typical

WS128K32-XH1X - 13 grams typical

WS128K32-XG4TX - 20 grams typical

Upgradeable to 512Kx32

• 68 lead, Hermetic CQFP (G2U), 22.4mm

(0.880 inch) square, 4.57mm (0.140 inch) high,

(Package 510)

Organized as 128Kx32; User Conﬁgurable as

256Kx16 or 512Kx8

Commercial, Industrial and Military Temperature

Ranges

ꢀ

FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X

Top View

Pin Description

I/O_0-31

A_0-16

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

I/O

I/O15

I/O24

I/O25

I/O26

I/O31

I/O30

I/O29

I/O28

WE_1-4

CS2

I/O14

I/O13

I/O12

OE#

CS_1-4

OE#

V_CC

I/O10

GND

I/O11

A14

A16

A11

I/O27

GND

Not Connected

A12

Block Diagram

WE1

A13

4 4

WE # CS #

OE#

A^0-16

I/O

I/O23

I/O22

I/O21

I/O20

I/O

I/O16

I/O17

I/O18

128K x 8

GND

I/O19

I/O^0-7

I/O^8-15

I/O^16-23

I/O^24-31

June 2004

Rev. 4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

12 3 4 5 6 7...9

中文翻译

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