5秒后页面跳转
WS128K32N-55H1I PDF预览

WS128K32N-55H1I

更新时间: 2024-11-04 23:42:59
品牌 Logo 应用领域
其他 - ETC 内存集成电路静态存储器
页数 文件大小 规格书
10页 506K
描述
SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC

WS128K32N-55H1I 数据手册

 浏览型号WS128K32N-55H1I的Datasheet PDF文件第2页浏览型号WS128K32N-55H1I的Datasheet PDF文件第3页浏览型号WS128K32N-55H1I的Datasheet PDF文件第4页浏览型号WS128K32N-55H1I的Datasheet PDF文件第5页浏览型号WS128K32N-55H1I的Datasheet PDF文件第6页浏览型号WS128K32N-55H1I的Datasheet PDF文件第7页 
n
Low Power Data Retention - only available in G2T  
package type  
n
Access Times of 15, 17, 20, 25, 35, 45, 55ns  
n Commercial, Industrial and Military Temperature Ranges  
n MIL-STD-883 Compliant Devices Available  
n
n
n
5 Volt Power Supply  
n
Packaging  
Low Power CMOS  
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic  
HIP (Package 400)  
TTL Compatible Inputs and Outputs  
• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140")  
(Package 502).  
n Built in Decoupling Caps and Multiple Ground Pins for  
Low Noise Operation  
• 68 lead, 22.4mm CQFP (G2T)1, 4.57mm (0.180"),  
(Package 509)  
n
Weight:  
WS128K32-XG1UX - 5 grams typical  
WS128K32-XG1TX - 5 grams typical  
WS128K32-XG2TX1 - 8 grams typical  
WS128K32-XH1X - 13 grams typical  
WS128K32-XG4TX1 - 20 grams typical  
• 68 lead, 23.9mm Low Profile CQFP (G1U), 3.57mm  
(0.140"), (Package 519)  
• 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06 mm  
(0.160"), (Package 524)  
n
Organized as 128Kx32; User Configurable as 256Kx16  
or 512Kx8  
n All devices are upgradeable to 512Kx32  
Note 1: Package Not Recommended For New Design  
I/O0-31 Data Inputs/Outputs  
A0-16 Address Inputs  
WE1-4 Write Enables  
CS1-4  
OE  
Chip Selects  
Output Enable  
Power Supply  
Ground  
VCC  
GND  
NC  
Not Connected  
November 2001 Revꢀ 9  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  

与WS128K32N-55H1I相关器件

型号 品牌 获取价格 描述 数据表
WS128K32N-55H1IA MICROSEMI

获取价格

SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS128K32N-55H1M ETC

获取价格

x32 SRAM Module
WS128K32N-55H1MA MICROSEMI

获取价格

SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS128K32N-55H1MA WEDC

获取价格

SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI
WS128K32N-55H1Q ETC

获取价格

x32 SRAM Module
WS128K32N-55HI ETC

获取价格

x32 SRAM Module
WS128K32N-55HIE WEDC

获取价格

SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP
WS128K32N-55HM ETC

获取价格

x32 SRAM Module
WS128K32N-55HQ ETC

获取价格

x32 SRAM Module
WS128K32N-55HQE WEDC

获取价格

SRAM Module, 512KX8, 55ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP