Outline Dimensions
Vishay Semiconductors
www.vishay.com
TO-220AB 3L
DIMENSIONS in millimeters and inches
A
M
M
0.014 B A
(6)
E
Thermal pad
(E)
A
A1
1
3
2
D
B
A
Q
D
C
(6)
(2)
(H1)
L1
H1
C
(6)
D2
(6) D
c
3 x b
3 x b2
D1
Detail B
Detail B
E1 (6)
A2
L
C
(b, b2)
b1, b3
Base metal
Plating
A
c1
(4)
c
2 x e
e1
View A - A
(4)
Section C - C and D - D
M
M
0.015 B A
Lead tip
Conforms to JEDEC® outline TO-220AB
MILLIMETERS
INCHES
MIN.
MILLIMETERS
INCHES
SYMBOL
NOTES
SYMBOL
NOTES
MIN.
4.25
1.14
2.50
0.69
0.38
1.20
1.14
0.36
0.36
14.85
8.38
MAX.
4.65
1.40
2.92
1.01
0.97
1.73
1.73
0.61
0.56
15.35
9.02
MAX.
0.183
0.055
0.115
0.040
0.038
0.068
0.068
0.024
0.022
0.604
0.355
MIN.
11.68
10.11
6.86
2.41
4.88
6.09
13.52
3.32
3.54
2.60
MAX.
13.30
10.51
8.89
MIN.
0.460
0.398
0.270
0.095
0.192
0.240
0.532
0.131
0.139
0.102
MAX.
0.524
0.414
0.350
0.105
0.208
0.255
0.552
0.150
0.154
0.118
A
A1
A2
b
0.167
0.045
0.098
0.027
0.015
0.047
0.045
0.014
0.014
0.585
0.330
D2
E
6, 7
3, 6
6
E1
e
2.67
b1
b2
b3
c
4
4
e1
H1
L
5.28
6.48
6
2
14.02
3.82
L1
Ø P
Q
c1
D
4
3
3.91
3.00
D1
Notes
(1)
(2)
(3)
Dimensioning and tolerancing as per ASME Y14.5M-1994
Lead dimension and finish uncontrolled in L1
Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4)
(5)
(6)
(7)
Dimension b1, b3, and c1 apply to base metal only
Controlling dimensions: inches
Thermal pad contour optional within dimensions E, H1, D2, and E1
Outline conforms to JEDEC® TO-220, except D2
Revision: 14-Mar-2022
Document Number: 96154
1
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