是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | 13 X 15 MM, PLASTIC, BGA-165 | Reach Compliance Code: | compliant |
风险等级: | 5.84 | Is Samacsys: | N |
最长访问时间: | 0.45 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | JESD-609代码: | e0 |
长度: | 15 mm | 内存密度: | 18874368 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 18 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX18 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.51 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 13 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD44164184F5-E50-EQ1 | NEC |
获取价格 |
18M-BIT DDRII SRAM 4-WORD BURST OPERATION | |
UPD44164184F5-E60-EQ1 | NEC |
获取价格 |
18M-BIT DDRII SRAM 4-WORD BURST OPERATION | |
UPD44164185AF5-E33-EQ2 | NEC |
获取价格 |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165 | |
UPD44164185AF5-E33-EQ2-A | RENESAS |
获取价格 |
1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44164185AF5-E33-EQ2-A | NEC |
获取价格 |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44164185AF5-E37-EQ2-A | NEC |
获取价格 |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44164185AF5-E37Y-EQ2 | NEC |
获取价格 |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165 | |
UPD44164185AF5-E37Y-EQ2-A | RENESAS |
获取价格 |
1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44164185AF5-E37Y-EQ2-A | NEC |
获取价格 |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44164185AF5-E40-EQ2-A | RENESAS |
获取价格 |
1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 |