QUANTUM Tx™ Linear TD-WEDGE Transmit Module
TQM6M9098
Features
Functional Block Diagram
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Low HPM TD-SCDMA Current – 410mA @ 24dBm
Low LPM TD-SCDMA Current – 105mA @ 0dBm
High System Efficiency – GSM850/900 45% ,
DCS/PCS 40%
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Small 21-pin 5x6x0.8mm3 module
PA Vramp power controlled – GMSK and 8PSK
TriQuint’s GaAs HBT / CuFlip® PA technology
Integrated SP8T with LPF
Built-in CMOS controller
Optimized for 50Ω system
Super Low Profile 0.8mm
MSL3 260°C / RoHS / Halogen-free
Applications
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GSM/EDGE/WEDGE handsets
GSM/EDGE/WEDGE wireless cards
TD handsets
Pin Out & Assignments
Pin#
Symbol
Description
Product Description
1
2
RFIN_HB
NC
High-Band RF Input
No connect
The TQM6M9098 is fully matched SP8T TD-WEDGE
transmit module that performs the function of 2G RF
power amplification, power control and 3G band
switching. The integration of the TQM6M9098 provides
state of the art GSM/EDGE efficiency, reduces the overall
BOM count and allows a flexible single phone board
layout to support up to four bands of WCDMA/LTE
operation. The PA core is a vramp power controlled,
multiple bias state, Quad-Band-GSM/EDGE PA designed
for use with Mediatek, Broadcom, Leadcore multi-mode
solutions supporting Linear EDGE as well as TD. The PA
output power is controlled by the Vramp signal coming
from the transceiver in GMSK. The Vramp is providing the
control function for the Idle current in EDGE and TD
mode. The HB PA is also supporting TD mode for B34 and
B39. Additionally, the small 5mm x 6mm package requires
minimum board space and allows for high levels of device
integration.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
VBS2
VBS1
Vdcdc
Vbatt
Vmode
Vramp
TX_EN
RFIN_LB
GND
TRx4
TRx3
TRx2
TRx1
TRx6
TRx5
GND
Digital Control Voltage
Digital Control Voltage
Collector Control Voltage
Battery Supply Voltage
Digital Control Voltage
DAC Control Voltage
Digital Control Voltage
Low-Band RF Input
Ground
Tx Rx Port
Tx Rx Port
Tx Rx Port
Tx Rx Port
Tx Rx Port
Tx Rx Port
Ground
Ground
Antenna Port
Ground
GND
ANT
GND
The TQM6M9098 is designed using TriQuint’s advanced
InGaP HBT technologies with CuFlip® assembly offering
state of the art reliability, temperature stability and
ruggedness.
Data Sheet: Rev G 11-12-13
Disclaimer: Subject to change without notice
© 2013 TriQuint
www.triquint.com
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