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TQM7M4006

更新时间: 2024-11-20 21:55:47
品牌 Logo 应用领域
TRIQUINT 放大器功率放大器过程控制系统分布式控制系统PCSGSMDCS
页数 文件大小 规格书
1页 73K
描述
3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module

TQM7M4006 数据手册

  
TQM7M4006  
Advance Data Sheet  
3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module  
Features  
Functional Block Diagram  
Very compact size – 5×5×1.1 mm3.  
Positive supply voltage – 2.9 to 4.5 V.  
High efficiency – typical GSM850 50%,  
GSM900 55%, DCS 50%, PCS 50%.  
CMOS internal closed-loop power control.  
55 dB dynamic control range.  
GPRS class 12 compatible.  
High-reliability InGaP technology.  
Ruggedness 10:1.  
Product Description  
50 input and output impedances.  
Few external components  
The TQM7M4006 is an advanced, quad-band, ultra-compact, 3V power amplifier  
module designed for mobile handset applications. The module sets new standards  
in performance and size by employing the latest technologies in power amplifier  
design. High-reliability is assured by InGaP HBT technology in combination with  
new CuFlip™ assembly technology. This fully integrated module, in a minimal  
form factor, provides a simple 50 interface on all input and output ports. It  
includes internal closed-loop power control with wide dynamic range, and on-  
board reference voltage. No external matching or bias components are required.  
Despite its very compact size, the module has exceptional efficiency in all bands.  
Applications  
GSM handsets  
GSM wireless cards and data links  
Incorporates two highly-integrated InGaP power amplifier die with a CMOS  
controller. All die are CuFlip™ mounted to minimize thermal excursions. Each  
amplifier has three gain stages with interstage matching implemented with a high  
Q passives technology for optimal performance. The CMOS controller implements  
a fully integrated closed-loop power control within the module, eliminating the  
need for external detection to assure the output power level. The latter is set  
directly from the Vramp input from the DAC. The module has Tx enable and band  
select inputs and a highly-stable on-board reference voltage. Excellent  
performance is achieved across the 824 – 849 MHz, 880 – 915 MHz, 1710 – 1785  
MHz, and 1850 – 1910 MHz bands. Module construction is a low-profile  
overmolded land-grid array on laminate.  
Package Style  
Electrical Specifications  
Units  
Parameter  
850 Band  
900 Band  
DCS/PCS  
Min  
Typ  
Max  
Min Typ  
Max  
8
Min  
32  
Typ  
Max  
8
Package Size : 5 x 5 x 1.1 mm  
GSM Pout  
Efficiency  
Pin  
34.5  
47  
2
35  
52  
5
34.5  
52  
2
35  
57  
5
32.5  
51  
5
dBm  
%
46  
2
8
dBm  
{PAGE }  
Advance Data Sheet: Subject to change without notice  
For additional information and latest specifications, see our website: { HYPERLINK "http://www.triquint.com" }  
Revision A, June 1, 2004  

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