TQM7M4006
Advance Data Sheet
3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module
Features
Functional Block Diagram
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Very compact size – 5×5×1.1 mm3.
Positive supply voltage – 2.9 to 4.5 V.
High efficiency – typical GSM850 50%,
GSM900 55%, DCS 50%, PCS 50%.
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•
•
•
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CMOS internal closed-loop power control.
55 dB dynamic control range.
GPRS class 12 compatible.
High-reliability InGaP technology.
Ruggedness 10:1.
Product Description
50 Ω input and output impedances.
Few external components
The TQM7M4006 is an advanced, quad-band, ultra-compact, 3V power amplifier
module designed for mobile handset applications. The module sets new standards
in performance and size by employing the latest technologies in power amplifier
design. High-reliability is assured by InGaP HBT technology in combination with
new CuFlip™ assembly technology. This fully integrated module, in a minimal
form factor, provides a simple 50 Ω interface on all input and output ports. It
includes internal closed-loop power control with wide dynamic range, and on-
board reference voltage. No external matching or bias components are required.
Despite its very compact size, the module has exceptional efficiency in all bands.
Applications
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•
GSM handsets
GSM wireless cards and data links
Incorporates two highly-integrated InGaP power amplifier die with a CMOS
controller. All die are CuFlip™ mounted to minimize thermal excursions. Each
amplifier has three gain stages with interstage matching implemented with a high
Q passives technology for optimal performance. The CMOS controller implements
a fully integrated closed-loop power control within the module, eliminating the
need for external detection to assure the output power level. The latter is set
directly from the Vramp input from the DAC. The module has Tx enable and band
select inputs and a highly-stable on-board reference voltage. Excellent
performance is achieved across the 824 – 849 MHz, 880 – 915 MHz, 1710 – 1785
MHz, and 1850 – 1910 MHz bands. Module construction is a low-profile
overmolded land-grid array on laminate.
Package Style
Electrical Specifications
Units
Parameter
850 Band
900 Band
DCS/PCS
Min
Typ
Max
Min Typ
Max
8
Min
32
Typ
Max
8
Package Size : 5 x 5 x 1.1 mm
GSM Pout
Efficiency
Pin
34.5
47
2
35
52
5
34.5
52
2
35
57
5
32.5
51
5
dBm
%
46
2
8
dBm
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Advance Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website: { HYPERLINK "http://www.triquint.com" }
Revision A, June 1, 2004