Datasheet > TP(HPTP)Mini1II.Gen

TP(HPTP)Mini1II.Gen

更新时间： 2024-09-17 14:50:59

品牌	Logo	应用领域
赛米控丹佛斯 - SEMIKRON		/
页数	文件大小	规格书
1页	75K
描述
Thermal Interface Materials MiniSKiiP II 1

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中文翻译

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TP(HPTP)Mini1II.Gen 数据手册

TP(HPTP)Mini1

Characteristics

Symbol Conditions

Characteristics of printing process

min.

typ.

max.

Unit

w_tp

material weight

140

170

200

Storage conditions

t_stg

T_stg

RH_stg

storage time

storage temperature

storage humidity

month

°C

TIM material characteristic

MiniSKiiP^®

γ_tp

specific gravity

resistivity

4.2

g/cm³

Ω/cm

1.2*10¹²

R_tp

kV/

E_tp

dielectric strength

Pre applied high

performance thermal paste

(silicone based)

(K*m)

λ_tp

thermal conductivity

2.5

*IMPORTANT INFORMATION AND WARNINGS

The specifications of SEMIKRON products may not be considered as guarantee or assurance

of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON

products describe only the usual characteristics of products to be expected in typical

applications, which may still vary depending on the specific application. Therefore, products

must be tested for the respective application in advance. Application adjustments may be

necessary. The user of SEMIKRON products is responsible for the safety of their applications

embedding SEMIKRON products and must take adequate safety measures to prevent the

applications from causing a physical injury, fire or other problem if any of SEMIKRON products

become faulty. The user is responsible to make sure that the application design is compliant

with all applicable laws, regulations, norms and standards. Except as otherwise explicitly

approved by SEMIKRON in a written document signed by authorized representatives of

SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the

product or any consequences of the use thereof can reasonably be expected to result in

personal injury. No representation or warranty is given and no liability is assumed with respect

to the accuracy, completeness and/or use of any information herein, including without limitation,

warranties of non-infringement of intellectual property rights of any third party. SEMIKRON

does not assume any liability arising out of the applications or use of any product; neither does

it convey any license under its patent rights, copyrights, trade secrets or other intellectual

property rights, nor the rights of others. SEMIKRON makes no representation or warranty of

non-infringement or alleged non-infringement of intellectual property rights of any third party

which may arise from applications. Due to technical requirements our products may contain

dangerous substances. For information on the types in question please contact the nearest

SEMIKRON sales office. This document supersedes and replaces all information previously

supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.

TP(HPTP)Mini1

Features

• New high performance thermal paste

• Superior heat dissipation

• Inhomogeneous honeycomb structure

• Optimized thickness of thermal paste

layer

• High process reliability due to

automated screen printing process

inhomog. honeycomb structure

Rev. 1.0 – 24.01.2017

中文翻译

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与TP(HPTP)Mini1II.Gen相关器件

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TP(HPTP)Mini2GB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 2
TP(HPTP)Mini2II.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 2
TP(HPTP)Mini3GB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 3
TP(HPTP)Mini3II.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 3
TP(HPTP)Mini8AC	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 8
TP(HPTP)Mini8AxB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 8
TP(HPTP)SEMITOP_E1	SEMIKRON	获取价格	Thermal Interface Materials
TP(HPTP)SEMITOP_E2	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP E2
TP(HPTP)SEMITOP2	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP 2
TP(HPTP)SEMITOP3	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP 3

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