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TP(P12)Mini2II. Gen PDF预览

TP(P12)Mini2II. Gen

更新时间: 2024-11-07 14:52:15
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赛米控丹佛斯 - SEMIKRON /
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描述
Thermal Interface Materials MiniSKiiP II 2

TP(P12)Mini2II. Gen 数据手册

  
TP(P12)Mini2II. Gen  
Characteristics  
Symbol Conditions  
Characteristics of printing process  
min.  
typ.  
max.  
Unit  
dtp  
thickness of thermal paste  
45  
55  
65  
µm  
Storage conditions  
tstg  
Tstg  
RHstg  
storage time  
storage temperature  
storage humidity  
18  
60  
95  
month  
°C  
%
-25  
10  
Characteristics of thermal paste  
MiniSKiiP®  
γ
specific gravity  
resistivity  
dielectric strength  
2.25  
1*1013  
20  
g/cm3  
/cm  
kV/cm  
W/  
(K*m)  
tp  
Rtp  
Etp  
Pre applied thermal paste  
Wacker P12 (silicone based)  
λ
thermal conductivity  
0.8  
tp  
* The specifications of our components may not be considered as an assurance of  
component characteristics. Components have to be tested for the respective application.  
Adjustments may be necessary. The use of SEMIKRON products in life support  
appliances and systems is subject to prior specification and written approval by  
SEMIKRON. We therefore strongly recommend prior consultation of our staff.  
TP(P12)Mini2II. Gen  
Features  
ꢀ Honeycomb structure  
ꢀ Optimized thickness of thermal paste  
layer  
ꢀ Enhanced heat dissipation  
ꢀ High process reliability due to  
automated screen printing process  
honeycomb structure  
© by SEMIKRON  
Rev. 0 – 24.02.2011  
1

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