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TP(HPTP)Mini2II.Gen

更新时间： 2024-11-22 14:55:35
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赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
1页 76K
描述
Thermal Interface Materials MiniSKiiP II 2

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中文翻译

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TP(HPTP)Mini2II.Gen 数据手册

  
TP(HPTP)Mini2II.Gen  
Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Characteristics of printing process  
wtp  
material weight  
530  
605  
680  
mg  
Storage conditions  
tstg  
Tstg  
RHstg  
storage time  
storage temperature  
storage humidity  
12  
40  
85  
month  
°C  
%
5
10  
TIM material characteristic  
MiniSKiiP®  
γtp  
specific gravity  
resistivity  
4.2  
g/cm3  
Ω/cm  
1.2*1012  
Rtp  
kV/  
Etp  
dielectric strength  
3
Pre applied high  
mm  
performance thermal paste  
(silicone based)  
W/  
(K*m)  
λtp  
thermal conductivity  
2.5  
*IMPORTANT INFORMATION AND WARNINGS  
The specifications of SEMIKRON products may not be considered as guarantee or assurance  
of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON  
products describe only the usual characteristics of products to be expected in typical  
applications, which may still vary depending on the specific application. Therefore, products  
must be tested for the respective application in advance. Application adjustments may be  
necessary. The user of SEMIKRON products is responsible for the safety of their applications  
embedding SEMIKRON products and must take adequate safety measures to prevent the  
applications from causing a physical injury, fire or other problem if any of SEMIKRON products  
become faulty. The user is responsible to make sure that the application design is compliant  
with all applicable laws, regulations, norms and standards. Except as otherwise explicitly  
approved by SEMIKRON in a written document signed by authorized representatives of  
SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the  
product or any consequences of the use thereof can reasonably be expected to result in  
personal injury. No representation or warranty is given and no liability is assumed with respect  
to the accuracy, completeness and/or use of any information herein, including without limitation,  
warranties of non-infringement of intellectual property rights of any third party. SEMIKRON  
does not assume any liability arising out of the applications or use of any product; neither does  
it convey any license under its patent rights, copyrights, trade secrets or other intellectual  
property rights, nor the rights of others. SEMIKRON makes no representation or warranty of  
non-infringement or alleged non-infringement of intellectual property rights of any third party  
which may arise from applications. Due to technical requirements our products may contain  
dangerous substances. For information on the types in question please contact the nearest  
SEMIKRON sales office. This document supersedes and replaces all information previously  
supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.  
TP(HPTP)Mini2II.Gen  
Features  
• New high performance thermal paste  
• Superior heat dissipation  
• Inhomogeneous honeycomb structure  
• Optimized thickness of thermal paste  
layer  
• High process reliability due to  
automated screen printing process  
inhomog. honeycomb structure  
© by SEMIKRON  
Rev. 1.0 – 24.03.2017  
1
1

中文翻译

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