Datasheet > TP(P12)Mini0

TP(P12)Mini0

更新时间： 2024-11-07 14:55:27

品牌	Logo	应用领域
赛米控丹佛斯 - SEMIKRON		/
页数	文件大小	规格书
1页	58K
描述
Thermal Interface Materials MiniSKiiP II 0

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中文翻译

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TP(P12)Mini0 数据手册

TP(P12)Mini0

Characteristics

Symbol Conditions

Characteristics of printing process

min.

typ.

max.

Unit

d_tp

thickness of thermal paste

µm

Storage conditions

t_stg

T_stg

RH_stg

storage time

storage temperature

storage humidity

month

°C

-25

Characteristics of thermal paste

MiniSKiiP^®

specific gravity

resistivity

dielectric strength

2.25

1*10¹³

g/cm³

/cm

kV/cm

(K*m)

R_tp

E_tp

Pre applied thermal paste

Wacker P12 (silicone based)

thermal conductivity

0.8

* The specifications of our components may not be considered as an assurance of

component characteristics. Components have to be tested for the respective application.

Adjustments may be necessary. The use of SEMIKRON products in life support

appliances and systems is subject to prior specification and written approval by

SEMIKRON. We therefore strongly recommend prior consultation of our staff.

TP(P12)Mini0

Features

ꢀ Honeycomb structure

ꢀ Optimized thickness of thermal paste

layer

ꢀ Enhanced heat dissipation

ꢀ High process reliability due to

automated screen printing process

honeycomb structure

Rev. 0 – 24.02.2011

中文翻译

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TP(P12)Mini2I.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 2
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TP(P12)Mini3 GB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 3
TP(P12)Mini3I.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 3
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