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TP(P12)Mini2 GB PDF预览

TP(P12)Mini2 GB

更新时间: 2024-11-22 14:55:35
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赛米控丹佛斯 - SEMIKRON /
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描述
Thermal Interface Materials MiniSKiiP II 2

TP(P12)Mini2 GB 数据手册

  
TP(P12)Mini2 GB  
Characteristics  
Symbol Conditions  
Characteristics of printing process  
min.  
typ.  
max.  
Unit  
thickness of thermal paste  
(after assembly)  
dtp  
29  
35  
41  
µm  
Storage conditions  
tstg  
Tstg  
RHstg  
storage time  
storage temperature  
storage humidity  
18  
60  
95  
month  
°C  
%
-25  
10  
MiniSKiiP®  
Characteristics of thermal paste  
γ
specific gravity  
resistivity  
2.25  
g/cm3  
/cm  
kV/  
mm  
W/  
(K*m)  
tp  
1*1013  
Rtp  
Etp  
Pre applied thermal paste  
Wacker P12 (silicone based)  
dielectric strength  
20  
λ
thermal conductivity  
0.8  
tp  
TP(P12)Mini2 GB  
* The specifications of our components may not be considered as an assurance of  
component characteristics. Components have to be tested for the respective application.  
Adjustments may be necessary. The use of SEMIKRON products in life support  
appliances and systems is subject to prior specification and written approval by  
SEMIKRON. We therefore strongly recommend prior consultation of our staff.  
Features  
ꢀ Honeycomb structure  
ꢀ Optimized thickness of thermal paste  
layer  
ꢀ Enhanced heat dissipation  
ꢀ High process reliability due to  
automated screen printing process  
honeycomb structure  
© by SEMIKRON  
Rev. 0 – 26.02.2015  
1

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