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TMS626162-12A PDF预览

TMS626162-12A

更新时间: 2024-10-28 15:54:51
品牌 Logo 应用领域
德州仪器 - TI 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
44页 655K
描述
1MX16 SYNCHRONOUS DRAM, PDSO50, 0.400 INCH, PLASTIC, TSOP-50

TMS626162-12A 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:TSOP2,针数:50
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
Is Samacsys:N访问模式:DUAL BANK PAGE BURST
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G50
长度:20.95 mm内存密度:16777216 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:50字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

TMS626162-12A 数据手册

 浏览型号TMS626162-12A的Datasheet PDF文件第2页浏览型号TMS626162-12A的Datasheet PDF文件第3页浏览型号TMS626162-12A的Datasheet PDF文件第4页浏览型号TMS626162-12A的Datasheet PDF文件第5页浏览型号TMS626162-12A的Datasheet PDF文件第6页浏览型号TMS626162-12A的Datasheet PDF文件第7页 
TMS626162  
524288 BY 16-BIT BY 2-BANK  
SYNCHRONOUS DYNAMIC RANDOM-ACCESS MEMORY  
SMOS683E – FEBRUARY 1995 – REVISED APRIL 1997  
DGE PACKAGE  
( TOP VIEW )  
Organization . . . 512K × 16 × 2 Banks  
3.3-V Power Supply (±10% Tolerance)  
Two Banks for On-Chip Interleaving  
(Gapless Accesses)  
1
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
V
V
SS  
DQ15  
DQ14  
CC  
2
DQ0  
DQ1  
High Bandwidth – Up to 83-MHz Data Rates  
3
CAS Latency (CL) Programmable to 2 or 3  
Cycles From Column-Address Entry  
4
V
V
SSQ  
DQ13  
DQ12  
SSQ  
DQ2  
5
Burst Sequence Programmable to Serial or  
Interleave  
6
DQ3  
7
V
V
CCQ  
DQ11  
DQ10  
CCQ  
DQ4  
Burst Length Programmable to 1, 2, 4, 8, or  
Full Page  
8
9
DQ5  
Chip Select and Clock Enable for  
Enhanced-System Interfacing  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
V
V
SSQ  
DQ9  
DQ8  
SSQ  
DQ6  
DQ7  
Cycle-by-Cycle DQ-Bus Mask Capability  
With Upper and Lower Byte Control  
V
V
CCQ  
CCQ  
DQML  
NC  
DQMU  
CLK  
CKE  
NC  
A9  
Auto-Refresh and Self-Refresh Capability  
4K Refresh (Total for Both Banks)  
W
CAS  
RAS  
CS  
High-Speed, Low-Noise, Low-Voltage TTL  
(LVTTL) Interface  
Power-Down Mode  
A11  
A10  
A0  
Compatible With JEDEC Standards  
Pipeline Architecture  
A8  
A7  
Temperature Ranges:  
Operating, 0°C to 70°C  
Storage, – 55°C to 150°C  
A1  
A6  
A2  
A5  
A3  
A4  
V
V
SS  
CC  
SYNCHRONOUS  
CLOCK CYLE  
TIME  
ACCESS TIME  
CLOCK TO  
OUTPUT  
REFRESH  
INTERVAL  
PIN NOMENCLATURE  
A0–A10  
Address Inputs  
t
t
t
t
t
REF  
CK3  
CK2  
AC3  
AC2  
(CL = 3) (CL = 2)  
(CL = 3)  
(CL = 2)  
A0–A10 Row Addresses  
A0–A7 Column Addresses  
A10 Automatic-Precharge Select  
Bank Select  
Column-Address Strobe  
Clock Enable  
’626162-12A  
12 ns  
12 ns  
15 ns  
18 ns  
9 ns  
9 ns  
64 ms  
64 ms  
’626162-12  
9 ns  
10 ns  
A11  
CAS  
CKE  
–12A speed device is supported only at –5/+10% V  
CL = CAS latency  
CC  
CLK  
CS  
System Clock  
Chip Select  
description  
DQ0–DQ15  
DQML, DQMU Data/Output Mask Enables  
NC  
RAS  
SDRAM Data Input/Output  
The TMS626162 device is  
a
high-speed  
16777216-bit synchronous dynamic random-  
access memory (SDRAM) organized as two  
banks of 524288 words with 16 bits per word.  
No Connect  
Row-Address Strobe  
Power Supply (3.3-V Typ)  
Power Supply for Output Drivers (3.3-V Typ)  
Ground  
Ground for Output Drivers  
Write Enable  
V
CC  
V
CCQ  
All inputs and outputs of the TMS626162 series  
are compatible with the LVTTL interface.  
V
SS  
V
W
SSQ  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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