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TK4P60D PDF预览

TK4P60D

更新时间: 2024-11-06 14:56:51
品牌 Logo 应用领域
东芝 - TOSHIBA 开关脉冲晶体管
页数 文件大小 规格书
9页 234K
描述
N-ch MOSFET, 600 V, 1.7 Ω@10V, DPAK, π-MOSⅦ

TK4P60D 技术参数

生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:unknown风险等级:5.74
雪崩能效等级(Eas):158 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):4 A最大漏极电流 (ID):4 A
最大漏源导通电阻:1.7 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
最大脉冲漏极电流 (IDM):16 A子类别:FET General Purpose Powers
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TK4P60D 数据手册

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TK4P60D  
MOSFETs Silicon N-Channel MOS (π-MOS)  
TK4P60D  
1. Applications  
Switching Voltage Regulators  
2. Features  
(1) Low drain-source on-resistance: RDS(ON) = 1.4 (typ.)  
(2) High forward transfer admittance: |Yfs| = 2.5 S (typ.)  
(3) Low leakage current: IDSS = 10 µA (max) (VDS = 600 V)  
(4) Enhancement mode: Vth = 2.4 to 4.4 V (VDS = 10 V, ID = 1 mA)  
3. Packaging and Internal Circuit  
1: Gate (G)  
2: Drain (D)(Heatsink)  
3: Source (S)  
DPAK  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
VDSS  
Rating  
600  
Unit  
V
Drain-source voltage  
Gate-source voltage  
VGSS  
±30  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
(Note 1)  
(Note 1)  
ID  
IDP  
PD  
4
16  
100  
158  
4
A
(Tc = 25)  
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
(Note 2)  
(Note 3)  
(Note 1)  
(Note 1)  
EAS  
IAR  
IDR  
IDRP  
Tch  
Reverse drain current (DC)  
Reverse drain current (pulsed)  
Channel temperature  
4
16  
150  
Storage temperature  
Tstg  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Start of commercial production  
2012-01  
2014-01-06  
Rev.2.0  
1

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