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SSU2N60B PDF预览

SSU2N60B

更新时间: 2024-02-02 12:04:08
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 645K
描述
600V N-Channel MOSFET

SSU2N60B 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-251包装说明:IPAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.33
雪崩能效等级(Eas):120 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):1.8 A
最大漏极电流 (ID):1.8 A最大漏源导通电阻:5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-251
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT APPLICABLE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):44 W
最大脉冲漏极电流 (IDM):6 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT APPLICABLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSU2N60B 数据手册

 浏览型号SSU2N60B的Datasheet PDF文件第1页浏览型号SSU2N60B的Datasheet PDF文件第2页浏览型号SSU2N60B的Datasheet PDF文件第3页浏览型号SSU2N60B的Datasheet PDF文件第5页浏览型号SSU2N60B的Datasheet PDF文件第6页浏览型号SSU2N60B的Datasheet PDF文件第7页 
Typical Characteristics (Continued)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.2  
1.1  
1.0  
Notes :  
0.9  
1. VGS = 0 V  
Notes :  
2. ID = 250 μA  
1. VGS = 10 V  
2. ID = 1.0 A  
0.8  
-100  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
T, Junction Temperature [oC]  
J
Figure 7. Breakdown Voltage Variation  
vs Temperature  
Figure 8. On-Resistance Variation  
vs Temperature  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
Operation in This Area  
is Limited by R DS(on)  
101  
100 µs  
1 ms  
10 ms  
DC  
100  
-1  
10  
Notes :  
1. TC = 25 oC  
2. T = 150 oC  
J
3. Single Pulse  
-2  
10  
10  
0
1
10  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [  
]
VDS, Drain-Source Voltage [V]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs Case Temperature  
D = 0 .5  
N otes  
1. Zθ JC (t)  
2. D uty Factor, D =t1/t2  
3. TJM T C P D M Z θ JC(t)  
:
1 0 0  
/W M ax.  
=
2.87  
0 .2  
-
=
*
0 .1  
0 .0 5  
PDM  
0 .0 2  
1 0 -1  
0 .0 1  
t1  
t2  
sin g le p u lse  
1 0-5  
1 0-4  
1 0-3  
1 0-2  
1 0-1  
1 00  
1 01  
t1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]  
Figure 11. Transient Thermal Response Curve  
©2001 Fairchild Semiconductor Corporation  
Rev. B, November 2001  

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