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SQ7414AEN_15 PDF预览

SQ7414AEN_15

更新时间: 2024-01-28 22:06:37
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
15页 613K
描述
Automotive N-Channel 60 V (D-S) 175 °C MOSFET

SQ7414AEN_15 数据手册

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SQ7414AEN  
Vishay Siliconix  
www.vishay.com  
Automotive N-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
• Low thermal resistance PowerPAK® 1212-8  
package with 1.07 mm profile  
PRODUCT SUMMARY  
VDS (V)  
60  
0.026  
R
DS(on) (Ω) at VGS = 10 V  
DS(on) (Ω) at VGS = 4.5 V  
R
0.036  
• PWM optimized  
ID (A)  
16  
• 100 % Rg and UIS tested  
• AEC-Q101 qualified  
Configuration  
Package  
Single  
PowerPAK 1212-8  
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
PowerPAK® 1212-8 Single  
D
8
D
D
7
D
6
D
5
G
1
S
2
S
N-Channel MOSFET  
S
3
S
4
G
1
Top View  
Bottom View  
Marking Code: Q013  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
V
VGS  
20  
TC = 25 °C  
16  
Continuous Drain Current a  
ID  
T
C = 125 °C  
16  
Continuous Source Current (Diode Conduction) a  
Pulsed Drain Current b  
IS  
16  
A
IDM  
IAS  
EAS  
72  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
18  
L = 0.1 mH  
16  
62  
mJ  
W
TC = 25 °C  
Maximum Power Dissipation b  
PD  
TC = 125 °C  
20  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
81  
UNIT  
Junction-to-Ambient  
PCB Mount c  
°C/W  
Junction-to-Case (Drain)  
RthJC  
2.4  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S15-1878-Rev. C, 17-Aug-15  
Document Number: 67050  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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