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SN74LVC2G74_09 PDF预览

SN74LVC2G74_09

更新时间: 2024-11-19 11:54:51
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德州仪器 - TI 触发器
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16页 540K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

SN74LVC2G74_09 数据手册

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SN74LVC2G74  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES203MAPRIL 1999REVISED FEBRUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
Supports 5-V VCC Operation  
Ioff Supports Partial-Power-Down Mode  
Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
1000-V Charged-Device Model (C101)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
VCC  
PRE  
CLR  
Q
GND  
Q
Q
1
2
3
4
8
7
6
5
CLK  
D
VCC  
1
2
3
4
8
7
6
5
CLK  
D
3 6  
2 7  
1 8  
CLR  
D
PRE  
VCC  
PRE  
CLR  
Q
Q
CLK  
GND  
Q
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the  
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time  
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs  
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,  
data at the D input can be changed without affecting the levels at the outputs.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC2G74YZPR  
_ _ _CP_  
C74_ _ _  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G74DCTR  
SN74LVC2G74DCUR  
SN74LVC2G74DCUT  
–40°C to 85°C  
VSSOP – DCU  
C74_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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