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SN74GTLP1394PWE4 PDF预览

SN74GTLP1394PWE4

更新时间： 2024-11-26 14:38:35
品牌 Logo 应用领域
德州仪器 - TI 光电二极管输出元件逻辑集成电路
页数 文件大小 规格书
23页 875K
描述
GTLP SERIES, 2-BIT TRANSCEIVER, CONFIGURABLE OUTPUT, PDSO16, GREEN, PLASTIC, TSSOP-16

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SN74GTLP1394PWE4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：TSSOP
包装说明：TSSOP, TSSOP16,.25针数：16
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.49系列：GTLP
JESD-30 代码：R-PDSO-G16JESD-609代码：e4
长度：5 mm逻辑集成电路类型：BUS TRANSCEIVER
湿度敏感等级：1位数：2
功能数量：1端口数量：3
端子数量：16最高工作温度：85 °C
最低工作温度：-40 °C输出特性：3-STATE
输出极性：CONFIGURABLE封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装等效代码：TSSOP16,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：260电源：3.3 V
传播延迟（tpd）：9 ns认证状态：Not Qualified
座面最大高度：1.2 mm子类别：Other Logic ICs
最大供电电压 (Vsup)：3.45 V最小供电电压 (Vsup)：3.15 V
标称供电电压 (Vsup)：3.3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：4.4 mm
Base Number Matches：1

SN74GTLP1394PWE4 数据手册

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SN74GTLP1394  
2-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE BUS TRANSCEIVER  
WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND SELECTABLE POLARITY  
www.ti.com  
SCES286F–OCTOBER 1999–REVISED APRIL 2005  
FEATURES  
Data-Transfer Rate and Signal Integrity in  
Distributed Loads  
•
•
•
•
TI-OPC™ Circuitry Limits Ringing on  
Unevenly Loaded Backplanes  
•
•
•
•
Ioff, Power-Up 3-State, and BIAS VCC Support  
Live Insertion  
OEC™ Circuitry Improves Signal Integrity and  
Reduces Electromagnetic Interference  
Polarity Control Selects True or  
Complementary Outputs  
Bidirectional Interface Between GTLP Signal  
Levels and LVTTL Logic Levels  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Split LVTTL Port Provides a Feedback Path  
for Control and Diagnostics Monitoring  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
•
•
•
•
LVTTL Interfaces Are 5-V Tolerant  
High-Drive GTLP Outputs (100 mA)  
LVTTL Outputs (–24 mA/24 mA)  
– 1000-V Charged-Device Model (C101)  
Variable Edge-Rate Control (ERC) Input  
Selects GTLP Rise and Fall Times for Optimal  
RGY PACKAGE  
(TOP VIEW)  
D, DGV, OR PW PACKAGE  
(TOP VIEW)  
OEBY  
Y1  
BIAS V  
GND  
B1  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
CC  
Y2  
1
16  
V
CC  
GND  
15  
14  
13  
12  
11  
10  
Y1  
Y2  
2
3
4
5
6
7
GND  
B1  
GND  
B2  
A1  
A2  
12 B2  
11  
10  
9
GND  
V
CC  
OEAB  
ERC  
V
REF  
A1  
A2  
OEAB  
T/C  
GND  
V
REF  
8
9
DESCRIPTION/ORDERING INFORMATION  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74GTLP1394RGYR  
SN74GTLP1394D  
TOP-SIDE MARKING  
QFN – RGY  
SOIC – D  
Tape and reel  
GP1394  
Tube  
GTLP1394  
–40°C to 85°C  
Tape and reel  
Tape and reel  
Tape and reel  
SN74GTLP1394DR  
TSSOP – PW  
TVSOP – DGV  
SN74GTLP1394PWR  
SN74GTLP1394DGVR  
GP394  
GP394  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
TI-OPC, OEC, TI are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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