SN74AUC1G79
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES387K–MARCH 2002–REVISED APRIL 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
•
Ioff Supports Partial-Power-Down Mode
Operation
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
•
•
Sub-1-V Operable
1000-V Charged-Device Model (C101)
Max tpd of 1.9 ns at 1.8 V
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRY PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
4
5
VCC
Y
D
CLK
GND
1
2
3
5
1
2
3
6
5
4
GND
B
D
CLK
GND
VCC
NC
Q
1
2
3
5
4
D
CLK
GND
VCC
2
1
VCC
A
4
Q
Q
See mechanical drawings for dimensions.
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
ORDERING INFORMATION
ORDERABLE PART
TA
PACKAGE(1)(2)
TOP-SIDE MARKING(3)
NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY
Reel of 3000
SN74AUC1G79YZPR
_ _ _UR_
Reel of 5000
Reel of 3000
Reel of 3000
SN74AUC1G79DRYR
SN74AUC1G79DBVR
SN74AUC1G79DCKR
PREVIEW
U79_
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
UR_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2002–2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.