SN74AUC1G80
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES388K–MARCH 2002–REVISED JANUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
•
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
•
Ioff Supports Partial-Power-Down Mode
Operation
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
•
•
Sub-1-V Operable
1000-V Charged-Device Model (C101)
Max tpd of 1.9 ns at 1.8 V
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
2
1
4
Q
VCC
GND
CLK
D
D
CLK
GND
1
2
3
5
1
2
3
5
D
CLK
GND
VCC
5
VCC
4
Q
4
Q
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000
SN74AUC1G80YZPR
_ _ _UX_
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
Reel of 3000
Reel of 3000
SN74AUC1G80DBVR
SN74AUC1G80DCKR
U80_
UX_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.