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SN74AUC1G86_08

更新时间： 2024-11-02 09:15:23
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德州仪器 - TI 输入元件
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12页 491K
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SINGLE 2-INPUT EXCLUSIVE-OR GATE

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SN74AUC1G86  
SINGLE 2-INPUT EXCLUSIVE-OR GATE  
www.ti.com  
SCES389J–MARCH 2002–REVISED NOVEMBER 2007  
1
FEATURES  
2
•
Available in the Texas Instruments NanoFree™  
Package  
•
•
•
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
•
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
Ioff Supports Partial Power-Down-Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 2.5 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
Y
GND  
B
VCC  
A
1
2
3
5
1
2
3
5
A
B
VCC  
B
5
VCC  
A
4
GND  
Y
4
Y
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single 2-input exclusive-OR gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V  
to 1.95-V VCC operation.  
The SN74AUC1G86 performs the Boolean function Y = A B or Y = AB + AB in positive logic.  
A common application is as a true/complement element. If the input is low, the other input is reproduced in true  
form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
_ _ _UH_  
NanoFree™  
Reel of 3000  
SN74AUC1G86YZPR  
WCSP (DSBGA) – YZP (Pb-free)  
–40°C to 85°C  
SOT (SOT-23) – DBV  
Reel of 3000  
Reel of 3000  
SN74AUC1G86DBVR  
SN74AUC1G86DCKR  
U86_  
UH_  
SOT (SC-70) – DCK  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2002–2007, Texas Instruments Incorporated  
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