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SN74AUC1G80YZPR PDF预览

SN74AUC1G80YZPR

更新时间： 2024-11-02 09:15:23
品牌 Logo 应用领域
德州仪器 - TI 触发器
页数 文件大小 规格书
12页 461K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

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SN74AUC1G80YZPR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：VFBGA, BGA5,2X3,20针数：5
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.44系列：AUC
JESD-30 代码：R-XBGA-B5JESD-609代码：e1
长度：1.4 mm负载电容（CL）：15 pF
逻辑集成电路类型：D FLIP-FLOP最大频率@ Nom-Sup：200000000 Hz
最大I（ol）：0.009 A湿度敏感等级：1
位数：1功能数量：1
端子数量：5最高工作温度：85 °C
最低工作温度：-40 °C输出特性：3-STATE
输出极性：INVERTED封装主体材料：UNSPECIFIED
封装代码：VFBGA封装等效代码：BGA5,2X3,20
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法：TR峰值回流温度（摄氏度）：260
电源：1.2/2.5 V最大电源电流（ICC）：0.01 mA
Prop。Delay @ Nom-Sup：3.9 ns传播延迟（tpd）：3.9 ns
认证状态：Not Qualified座面最大高度：0.5 mm
子类别：FF/Latches最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.2 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
触发器类型：POSITIVE EDGE宽度：0.9 mm
最小 fmax：275 MHzBase Number Matches：1

SN74AUC1G80YZPR 数据手册

 浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第2页浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第3页浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第4页浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第5页浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第6页浏览型号SN74AUC1G80YZPR的Datasheet PDF文件第7页 
SN74AUC1G80  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
www.ti.com  
SCES388K–MARCH 2002–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
•
Optimized for 1.8-V Operation and Is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 1.9 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
Q
VCC  
GND  
CLK  
D
D
CLK  
GND  
1
2
3
5
1
2
3
5
D
CLK  
GND  
VCC  
5
VCC  
4
Q
4
Q
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed  
specifically for 1.65-V to 1.95-V VCC operation.  
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the  
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the  
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without  
affecting the levels at the outputs.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74AUC1G80YZPR  
_ _ _UX_  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
SN74AUC1G80DBVR  
SN74AUC1G80DCKR  
U80_  
UX_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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