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SN74AUC1G79YEAR PDF预览

SN74AUC1G79YEAR

更新时间： 2024-09-13 22:22:27
品牌 Logo 应用领域
德州仪器 - TI 触发器锁存器逻辑集成电路
页数 文件大小 规格书
13页 333K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

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中文翻译

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SN74AUC1G79YEAR 技术参数

是否Rohs认证：不符合生命周期：Obsolete
零件包装代码：DSBGA包装说明：MO-211EA, DSBGA-5
针数：5Reach Compliance Code：not_compliant
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：5.7Is Samacsys：N
系列：AUCJESD-30 代码：R-PBGA-B5
长度：1.4 mm负载电容（CL）：150 pF
逻辑集成电路类型：D FLIP-FLOP最大频率@ Nom-Sup：200000000 Hz
最大I（ol）：0.005 A位数：1
功能数量：1端子数量：5
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA5,2X3,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：1.2/2.5 V
Prop。Delay @ Nom-Sup：3.9 ns传播延迟（tpd）：3.9 ns
认证状态：Not Qualified座面最大高度：0.5 mm
子类别：FF/Latches最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.2 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED触发器类型：POSITIVE EDGE
宽度：0.9 mm最小 fmax：275 MHz
Base Number Matches：1

SN74AUC1G79YEAR 数据手册

 浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第2页浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第3页浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第4页浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第5页浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第6页浏览型号SN74AUC1G79YEAR的Datasheet PDF文件第7页 
SN74AUC1G79  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
www.ti.com  
SCES387H–MARCH 2002–REVISED JUNE 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
5
4
D
CLK  
GND  
V
CC  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Q
•
Ioff Supports Partial-Power-Down Mode  
Operation  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
•
•
•
•
•
Sub-1-V Operable  
Max tpd of 1.9 ns at 1.8 V  
3
2
1
4
5
GND  
CLK  
D
Q
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
V
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed  
specifically for 1.65-V to 1.95-V VCC operation.  
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the  
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the  
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting  
the levels at the outputs.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™  
WCSP (DSBGA) – YEA  
SN74AUC1G79YEAR  
NanoFree™  
WCSP (DSBGA) – YZA (Pb-free)  
SN74AUC1G79YZAR  
SN74AUC1G79YEPR  
SN74AUC1G79YZPR  
Tape and reel  
_ _ _UR_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Tape and reel  
Tape and reel  
SN74AUC1G79DBVR  
SN74AUC1G79DCKR  
U79_  
UR_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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