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SN74AUC1G19YEPR PDF预览

SN74AUC1G19YEPR

更新时间： 2024-11-02 20:02:07
品牌 Logo 应用领域
德州仪器 - TI 驱动输出元件逻辑集成电路
页数 文件大小 规格书
17页 930K
描述
AUC SERIES, OTHER DECODER/DRIVER, COMPLEMENTARY OUTPUT, PBGA6, DSBGA-6

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SN74AUC1G19YEPR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：VFBGA, BGA6,2X3,20
针数：6Reach Compliance Code：not_compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.6系列：AUC
输入调节：STANDARDJESD-30 代码：R-PBGA-B6
长度：1.4 mm负载电容（CL）：15 pF
逻辑集成电路类型：OTHER DECODER/DRIVER最大I（ol）：0.005 A
功能数量：1端子数量：6
最高工作温度：85 °C最低工作温度：-40 °C
输出极性：COMPLEMENTARY封装主体材料：PLASTIC/EPOXY
封装代码：VFBGA封装等效代码：BGA6,2X3,20
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法：TAPE AND REEL峰值回流温度（摄氏度）：NOT SPECIFIED
电源：1.2/2.5 VProp。Delay @ Nom-Sup：3 ns
传播延迟（tpd）：4.6 ns认证状态：Not Qualified
座面最大高度：0.5 mm子类别：Decoder/Drivers
最大供电电压 (Vsup)：2.7 V最小供电电压 (Vsup)：0.8 V
标称供电电压 (Vsup)：1.1 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：0.9 mmBase Number Matches：1

SN74AUC1G19YEPR 数据手册

 浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第2页浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第3页浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第4页浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第5页浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第6页浏览型号SN74AUC1G19YEPR的Datasheet PDF文件第7页 
SN74AUC1G19  
1-OF-2 DECODER/DEMULTIPLEXER  
www.ti.com  
SCES626D–MARCH 2005–REVISED APRIL 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Max tpd of 3 ns at 1.8 V  
Low Power Consumption, 10-µA Max ICC  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
±8-mA Output Drive at 1.8 V VCC  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
A
Y
A
GND  
E
Y
V
Y
1
2
3
6
5
4
0
0
1
2
3
6
A
GND  
E
Y
V
Y
0
CC  
1
GND  
E
V
Y
CC  
1
5
4
CC  
1
DRY PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
4
Y
V
E
GND  
A
1
1
2
3
6
5
4
A
Y0  
2
1
5
CC  
GND  
E
VCC  
Y1  
6
Y
0
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to  
1.95-V VCC operation.  
The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to  
the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of  
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 2005–2007, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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