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SN74AUC1G240YEAR

更新时间： 2024-11-02 12:58:27
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路输出元件
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13页 487K
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SN74AUC1G240  
SINGLE BUFFER/DRIVER  
WITH 3-STATE OUTPUT  
www.ti.com  
SCES384I–MARCH 2002–REVISED FEBRUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 2.5 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
Y
VCC  
GND  
A
OE  
A
1
2
3
5
1
2
3
5
OE  
A
VCC  
5
VCC  
OE  
4
GND  
Y
4
Y
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The SN74AUC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable  
(OE) input is high.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
SN74AUC1G240YZPR  
_ _ _UK_  
–40°C to 85°C  
Reel of 3000  
Reel of 3000  
SN74AUC1G240DBVR  
SN74AUC1G240DCKR  
U40_  
UK_  
SOT (SC-70) – DCK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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