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SN74AUC1G32 PDF预览

SN74AUC1G32

更新时间: 2024-11-01 23:03:11
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
13页 324K
描述
SINGLE 2-INPUT POSITIVE-OR GATE

SN74AUC1G32 数据手册

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ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢊ  
ꢀꢋ ꢁꢈ ꢌ ꢍ ꢊ ꢎꢋꢁ ꢏꢅꢐ ꢏꢑ ꢀꢋ ꢐ ꢋꢒꢍꢎ ꢑ ꢓ ꢈ ꢄꢐꢍ  
SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
Optimized for 1.8-V Operation and Is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
1
2
3
5
4
A
B
GND  
V
Y
CC  
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
D
D
D
D
D
Sub 1-V Operable  
Max t of 2.4 ns at 1.8 V  
pd  
Low Power Consumption, 10-µA Max I  
3 4  
2
GND  
B
Y
V
CC  
8-mA Output Drive at 1.8 V  
1 5  
A
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
D
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single 2-input positive-OR gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V  
CC  
to 1.95-V V  
operation.  
CC  
The SN74AUC1G32 performs the Boolean function Y + A ) B or Y + A B in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74AUC1G32YEAR  
SN74AUC1G32YZAR  
SN74AUC1G32YEPR  
SN74AUC1G32YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Tape and reel  
_ _ _UG_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
Tape and reel  
Tape and reel  
SN74AUC1G32DBVR  
SN74AUC1G32DCKR  
U32_  
UG_  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢐꢠ  
Copyright 2003, Texas Instruments Incorporated  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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