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SN74AUC1G66 PDF预览

SN74AUC1G66

更新时间: 2024-11-26 23:03:11
品牌 Logo 应用领域
德州仪器 - TI 开关
页数 文件大小 规格书
15页 295K
描述
SINGLE BILATERAL ANALOG SWITCH

SN74AUC1G66 数据手册

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SN74AUC1G66  
SINGLE BILATERAL ANALOG SWITCH  
SCES386F – MARCH 2002 – REVISED APRIL 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar and NanoFree Packages  
Optimized for 1.8-V Operation and Is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
1
2
3
A
B
GND  
V
CC  
5
4
C
Sub 1-V Operable  
Low Power Consumption, 10-µA Max I  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
CC  
YEA OR YZA PACKAGE  
(BOTTOM VIEW)  
3 4  
2
GND  
B
C
High Speed – Max 0.2 ns (V  
= 1.8 V,  
CC  
C = 15 pF)  
L
1 5  
A
V
CC  
Low On-State Impedance – Typically 9 Ω  
(V = 2.3 V)  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single analog switch is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V to 1.95-V  
CC  
V
operation.  
CC  
The SN74AUC1G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 3.6-V  
(peak) to be transmitted in either direction.  
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
NanoStar  
WCSP (DSBGA) – YEA  
Tape and reel  
Tape and reel  
SN74AUC1G66YEAR  
SN74AUC1G66YZAR  
_ _ _U6_  
NanoFree  
–40°C to 85°C  
WCSP (DSBGA) – YZA (Pb-free)  
SOT (SOT-23) – DBV  
Tape and reel  
Tape and reel  
SN74AUC1G66DBVR  
SN74AUC1G66DCKR  
U66_  
U6_  
SOT (SC-70) – DCK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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