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SCBS707E − SEPTEMBER 1997 − REVISED OCTOBER 2003
SN54LVTH2245 . . . J OR W PACKAGE
SN74LVTH2245 . . . DB, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
)
CC
Support Unregulated Battery Operation
Down to 2.7 V
DIR
A1
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
Typical V
<0.8 V at V
(Output Ground Bounce)
OE
B1
B2
B3
B4
B5
B6
B7
B8
OLP
CC
= 3.3 V, T = 25°C
A2
A
A3
B-Port Outputs Have Equivalent 22-Ω
Series Resistors, So No External Resistors
Are Required
A4
A5
A6
D
D
I
and Power-Up 3-State Support Hot
off
A7
Insertion
A8
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
GND
SN54LVTH2245 . . . FK PACKAGE
(TOP VIEW)
D Latch-Up Performance Exceeds 500 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
3
2
1 20 19
18
A3
A4
A5
A6
A7
4
5
6
7
8
B1
B2
B3
B4
B5
17
16
15
14
description/ordering information
These octal bus transceivers are designed
specifically for low-voltage (3.3-V) V
operation,
CC
9 10 11 12 13
but with the capability to provide a TTL interface
to a 5-V system environment.
These devices are designed for asynchronous
communication between data buses. They
transmit data from the A bus to the B bus or from
the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)
input can be used to disable the devices so the buses are effectively isolated.
ORDERING INFORMATION
ORDERABLE
†
T
PACKAGE
TOP-SIDE MARKING
A
PART NUMBER
SN74LVTH2245DW
SN74LVTH2245DWR
SN74LVTH2245NSR
SN74LVTH2245DBR
SN74LVTH2245PW
SN74LVTH2245PWR
SN74LVTH2245DGVR
SNJ54LVTH2245J
Tube
SOIC − DW
LVTH2245
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
LVTH2245
LK245
SSOP − DB
−40°C to 85°C
−55°C to 125°C
TSSOP − PW
LK245
Tape and reel
Tape and reel
Tube
TVSOP − DGV
CDIP − J
LK245
SNJ54LVTH2245J
SNJ54LVTH2245W
SNJ54LVTH2245FK
CFP − W
Tube
SNJ54LVTH2245W
SNJ54LVTH2245FK
LCCC − FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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1
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