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SN54LVTH2245J PDF预览

SN54LVTH2245J

更新时间： 2024-11-19 23:03:07
品牌 Logo 应用领域
德州仪器 - TI 总线收发器输出元件
页数 文件大小 规格书
7页 111K
描述
3.3-V ABT OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

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SN54LVTH2245J 技术参数

生命周期：Obsolete零件包装代码：DIP
包装说明：DIP,针数：20
Reach Compliance Code：unknown风险等级：5.84
其他特性：WITH DIRECTION CONTROL系列：LVT
JESD-30 代码：R-GDIP-T20长度：24.195 mm
逻辑集成电路类型：BUS TRANSCEIVER位数：8
功能数量：1端口数量：2
端子数量：20最高工作温度：125 °C
最低工作温度：-55 °C输出特性：3-STATE WITH SERIES RESISTOR
输出极性：TRUE封装主体材料：CERAMIC, GLASS-SEALED
封装代码：DIP封装形状：RECTANGULAR
封装形式：IN-LINE传播延迟（tpd）：5.3 ns
认证状态：Not Qualified座面最大高度：5.08 mm
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：2.7 V
标称供电电压 (Vsup)：3.3 V表面贴装：NO
技术：BICMOS温度等级：MILITARY
端子形式：THROUGH-HOLE端子节距：2.54 mm
端子位置：DUAL宽度：7.62 mm
Base Number Matches：1

SN54LVTH2245J 数据手册

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SN54LVTH2245, SN74LVTH2245  
3.3-V ABT OCTAL BUS TRANSCEIVERS  
WITH 3-STATE OUTPUTS  
SCBS707C – SEPTEMBER 1997 – REVISED APRIL 1999  
SN54LVTH2245 . . . J OR W PACKAGE  
SN74LVTH2245 . . . DB, DW, OR PW PACKAGE  
(TOP VIEW)  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V  
Operation and Low Static-Power  
Dissipation  
DIR  
A1  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
V
CC  
B-Port Outputs Have Equivalent 22-Ω  
Series Resistors, So No External Resistors  
Are Required  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
A2  
A3  
I
and Power-Up 3-State Support Hot  
A4  
off  
Insertion  
A5  
A6  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
A7  
A8  
GND  
Support Mixed-Mode Signal Operation (5-V  
Input and Output Voltages With 3.3-V V  
)
CC  
SN54LVTH2245 . . . FK PACKAGE  
(TOP VIEW)  
Support Unregulated Battery Operation  
Down to 2.7 V  
Typical V  
< 0.8 V at V  
(Output Ground Bounce)  
OLP  
= 3.3 V, T = 25°C  
CC  
A
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
3
2
1 20 19  
18  
A3  
A4  
A5  
A6  
A7  
4
5
6
7
8
B1  
B2  
B3  
B4  
B5  
17  
16  
15  
14  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
9 10 11 12 13  
Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages, Ceramic Chip Carriers (FK),  
Ceramic Flat (W) Packages, and Ceramic  
(J) DIPs  
description  
These octal bus transceivers are designed specifically for low-voltage (3.3-V) V  
capability to provide a TTL interface to a 5-V system environment.  
operation, but with the  
CC  
These devices are designed for asynchronous communication between data buses. They transmit data from  
the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR)  
input. The output-enable (OE) input can be used to disable the devices so the buses are effectively isolated.  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.  
The B-port outputs, which are designed to source or sink up to 12 mA, include equivalent 22-Ω series resistors  
to reduce overshoot and undershoot.  
When V is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
through a pullup resistor;  
CC  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1999, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567

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