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SKCD06C120IHD_10 PDF预览

SKCD06C120IHD_10

更新时间: 2024-11-14 12:20:19
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赛米控丹佛斯 - SEMIKRON 二极管
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2页 219K
描述
CAL-DIODE

SKCD06C120IHD_10 数据手册

 浏览型号SKCD06C120IHD_10的Datasheet PDF文件第2页 
SKCD 06 C 120 I HD  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.1 mA  
Ts = 80 °C, Tj = 150 °C  
VRRM  
IF(AV)  
IFSM  
1200  
8
V
A
Tj = 25 °C  
Tj = 150 °C  
60  
A
10 ms  
sin 180°  
55  
A
Tjmax  
150  
°C  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 6 A  
i2t  
IR  
15  
A2s  
mA  
mA  
V
Tj = 150 °C, 10 ms, sin 180°  
Tj = 25 °C, VRRM = 1200 V  
0.10  
VRRM = 1200 V  
Size: 2,44 mm x 2,44 mm  
Tj = 125 °C, VRRM = 1200 V  
Tj = 25 °C, IF = 5 A  
Tj = 125 °C, IF = 5 A  
Tj = 125 °C  
VF  
1.50  
1.50  
1.77  
1.77  
V
V(TO)  
rT  
0.92  
V
SKCD 06 C 120 I HD  
Tj = 125 °C  
119.8  
m  
Dynamic Characteristics  
Symbol Conditions  
Features  
• high current density  
min.  
typ.  
max.  
Unit  
• easy paralleling due to a small forward  
voltage spread  
• positive temperature coefficient  
• very soft recovery behavior  
• small switching losses  
• high ruggedness  
• compatible to thick wire bonding  
• compatible to standard solder  
processes  
Tj = 25 °C, 6 A, 600 V, 120 A/µs  
trr  
µs  
ns  
µC  
µC  
A
Tj = 125 °C, 6 A, 600 V, 120 A/µs  
Tj = 25 °C, 6 A, 600 V, 120 A/µs  
Tj = 125 °C, 6 A, 600 V, 120 A/µs  
Tj = 25 °C, 6 A, 600 V, 120 A/µs  
Tj = 125 °C, 6 A, 600 V, 120 A/µs  
trr  
Qrr  
Qrr  
Irrm  
Irrm  
1.4  
4.1  
A
Thermal Characteristics  
Symbol Conditions  
Typical Applications*  
min.  
typ.  
max.  
Unit  
• freewheeling diode for IGBT  
• particularly suitable for frequencies < 8  
kHz  
Tj  
-40  
-40  
150  
150  
250  
320  
°C  
°C  
°C  
°C  
Tstg  
Tsolder  
Tsolder  
10 min.  
5 min.  
sold. on 0,38 mm DCB, reference point  
on copper heatsink close to the chip  
Rth(j-s)  
2.46  
K/W  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
2.44 x 2.44  
mm2  
mm2  
Area total  
Anode  
5.95  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, diameter 500 µm  
wafer frame  
Chips /  
Package  
1720 (5" Wafer)  
pcs  
SKCD  
© by SEMIKRON  
Rev. 0 – 18.02.2010  
1

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