SKCD 06 C 120 I HD
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
Tj = 25 °C, IR = 0.1 mA
Ts = 80 °C, Tj = 150 °C
VRRM
IF(AV)
IFSM
1200
8
V
A
Tj = 25 °C
Tj = 150 °C
60
A
10 ms
sin 180°
55
A
Tjmax
150
°C
Electrical Characteristics
Symbol Conditions
CAL-DIODE
min.
typ.
max.
Unit
IF = 6 A
i2t
IR
15
A2s
mA
mA
V
Tj = 150 °C, 10 ms, sin 180°
Tj = 25 °C, VRRM = 1200 V
0.10
VRRM = 1200 V
Size: 2,44 mm x 2,44 mm
Tj = 125 °C, VRRM = 1200 V
Tj = 25 °C, IF = 5 A
Tj = 125 °C, IF = 5 A
Tj = 125 °C
VF
1.50
1.50
1.77
1.77
V
V(TO)
rT
0.92
V
SKCD 06 C 120 I HD
Tj = 125 °C
119.8
mΩ
Dynamic Characteristics
Symbol Conditions
Features
• high current density
min.
typ.
max.
Unit
• easy paralleling due to a small forward
voltage spread
• positive temperature coefficient
• very soft recovery behavior
• small switching losses
• high ruggedness
• compatible to thick wire bonding
• compatible to standard solder
processes
Tj = 25 °C, 6 A, 600 V, 120 A/µs
trr
µs
ns
µC
µC
A
Tj = 125 °C, 6 A, 600 V, 120 A/µs
Tj = 25 °C, 6 A, 600 V, 120 A/µs
Tj = 125 °C, 6 A, 600 V, 120 A/µs
Tj = 25 °C, 6 A, 600 V, 120 A/µs
Tj = 125 °C, 6 A, 600 V, 120 A/µs
trr
Qrr
Qrr
Irrm
Irrm
1.4
4.1
A
Thermal Characteristics
Symbol Conditions
Typical Applications*
min.
typ.
max.
Unit
• freewheeling diode for IGBT
• particularly suitable for frequencies < 8
kHz
Tj
-40
-40
150
150
250
320
°C
°C
°C
°C
Tstg
Tsolder
Tsolder
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
Rth(j-s)
2.46
K/W
Mechanical Characteristics
Symbol Conditions
Values
Unit
Raster
size
2.44 x 2.44
mm2
mm2
Area total
Anode
5.95
bondable (Al)
Cathode
Wire bond
Package
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
wafer frame
Chips /
Package
1720 (5" Wafer)
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
1