SiZ320DT
Vishay Siliconix
www.vishay.com
Dual N-Channel 25 V (D-S) MOSFETs
FEATURES
• TrenchFET® Gen IV power MOSFETs
PowerPAIR® 3 x 3
G2
8
S2
7
S2
6
S2
• 100 % Rg and UIS tested
5
S1/D2
(Pin 9)
• Optimized Qgs/Qgs ratio improves switching
characteristics
D1
1
G1
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
2
D1
3
D1
1
4
D1
Top View
Bottom View
D
1
APPLICATIONS
• CPU core power
PRODUCT SUMMARY
CHANNEL-1 CHANNEL-2
G
1
• Computer / server peripherals
• POL
VDS (V)
25
0.00830
0.01270
4.3
25
0.00424
0.00658
7.9
N-Channel 1
MOSFET
S /D
R
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
1
2
R
• Synchronous buck converter
• Telecom DC/DC
Qg typ. (nC)
D (A) a, g
Configuration
G
2
I
30
40
N-Channel 2
MOSFET
S
2
Dual
ORDERING INFORMATION
Package
PowerPAIR 3 x 3
SiZ320DT-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
25
+16, -12
40 a
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
25
+16, -12
30 a
29.2 a
17.2 b, c
13.7 b, c
80
13.9
3.1 b, c
12
7.2
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
T
40 a
Continuous drain current (TJ = 150 °C)
ID
24.8 b, c
19.8 b, c
120
25.8
3.5 b, c
A
Pulsed drain current (100 μs pulse width)
Continuous source drain diode current
IDM
IS
T
C = 25 °C
TA = 25 °C
L = 100 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
18
16.2
mJ
W
16.7
10.7
3.7 b, c
2.4 b, c
31
20
4.2 b, c
2.7 b, c
T
C = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
27
MAX.
34
TYP.
24
MAX.
30
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
t 10 s
Steady state
RthJA
RthJC
°C/W
6
7.5
3.2
4
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 69 °C/W for channel-1 and 64 °C/W for channel-2
g. TC = 25 °C
S17-0302-Rev. A, 27-Feb-17
Document Number: 68279
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000