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SIHFU9220-E3 PDF预览

SIHFU9220-E3

更新时间: 2024-11-21 12:46:59
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
7页 4558K
描述
Power MOSFET

SIHFU9220-E3 数据手册

 浏览型号SIHFU9220-E3的Datasheet PDF文件第2页浏览型号SIHFU9220-E3的Datasheet PDF文件第3页浏览型号SIHFU9220-E3的Datasheet PDF文件第4页浏览型号SIHFU9220-E3的Datasheet PDF文件第5页浏览型号SIHFU9220-E3的Datasheet PDF文件第6页浏览型号SIHFU9220-E3的Datasheet PDF文件第7页 
IRFR9220, IRFU9220, SiHFR9220, SiHFU9220  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
- 200  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
VGS = - 10 V  
1.5  
RoHS*  
• Surface Mount (IRFR9220/SiHFR9220)  
• Straight Lead (IRFUFU9220/SiHFU9220)  
• Available in Tape and Reel  
• P-Channel  
Qg (Max.) (nC)  
20  
3.3  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
11  
Configuration  
Single  
• Fast Switching  
S
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
G
Third Power MOSFETs technology is the key to Vishay  
advanced line of Power MOSFET transistors. The efficient  
geometry and unique processing of the Power MOSFETs  
design achieve very low on-state resistance combined with  
high transconductance and extreme device ruggedness.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR9220PbF  
SiHFR9220-E3  
IRFR9220  
DPAK (TO-252)  
IIRFR9220TRLPbFa  
SiHFR9220TL-E3a  
IRFR9220TRLa  
DPAK (TO-252)  
IRFR9220TRRPbFa  
SiHFR9220TR-E3a  
IRFR9220TRRa  
SiHFR9220TRa  
DPAK (TO-252)  
IRFR9220TRPbFa  
SiHFR9220T-E3a  
IRFR9220TRa  
IPAK (TO-251)  
IRFU9220PbF  
SiHFU9220-E3  
IRFU9220  
Lead (Pb)-free  
SnPb  
SiHFR9220  
SiHFR9220TLa  
SiHFR9220Ta  
SiHFU9220  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
- 200  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
T
C = 25 °C  
- 3.6  
- 2.3  
- 14  
0.33  
0.020  
310  
Continuous Drain Current  
VGS at - 10 V  
ID  
TC =100°C  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
- 3.6  
4.2  
Repetitive Avalanche Energya  
EAR  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
42  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
- 5.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 50 V, Starting TJ = 25 °C, L = 35 mH, RG = 25 Ω, IAS = - 3.6 A (see fig. 12).  
c. ISD - 3.9 A, dI/dt 95 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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