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SIHFU9210 PDF预览

SIHFU9210

更新时间: 2024-11-25 06:11:43
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 1583K
描述
Power MOSFET

SIHFU9210 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-251
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.15其他特性:AVALANCHE RATED
雪崩能效等级(Eas):300 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):1.9 A最大漏极电流 (ID):1.9 A
最大漏源导通电阻:3 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-251JESD-30 代码:R-PSIP-T3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):240极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):25 W最大脉冲漏极电流 (IDM):7.6 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHFU9210 数据手册

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IRFR9210, IRFU9210, SiHFR9210, SiHFU9210  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
- 200  
Available  
• Repetitive Avalanche Rated  
R
DS(on) (Ω)  
VGS = - 10 V  
3.0  
RoHS*  
• Surface Mount (IRFR9210/SiHFR9210)  
• Straight Lead (IRFU9210/SiHFU9210)  
• Available in Tape and Reel  
• P-Channel  
Qg (Max.) (nC)  
8.9  
2.1  
3.9  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
Configuration  
Single  
• Fast Switching  
S
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
G
The Power MOSFETs technology is the key to Vishay’s  
advanced line of Power MOSFET transistors. The efficient  
geometry and unique processing of the Power MOSFET  
design achieve very low on-state resistance combined with  
high transconductance and extreme device ruggedness.  
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
DPAK (TO-252)  
-
IPAK (TO-251)  
IRFU9210PbF  
SiHFU9210-E3  
IRFU9210  
IRFR9210PbF  
SiHFR9210-E3  
IRFR9210  
IRFR9210TRPbFa  
SiHFR9210T-E3a  
IRFR9210TRa  
Lead (Pb)-free  
-
IRFR9210TRLa  
SiHFR9210TLa  
SnPb  
SiHFR9210  
SiHFR9210Ta  
SiHFU9210  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
- 200  
20  
V
T
C = 25 °C  
- 1.9  
- 1.2  
- 7.6  
0.20  
Continuous Drain Current  
V
GS at - 10 V  
ID  
A
TC =100°C  
Pulsed Drain Currenta  
Linear Derating Factor  
IDM  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
0.020  
300  
- 1.9  
2.5  
EAS  
IAR  
EAR  
mJ  
A
mJ  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TC = 25 °C  
TA = 25 °C  
25  
2.5  
PD  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
- 5.0  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 50 V, starting TJ = 25 °C, L = 124 mH, RG = 25 Ω, IAS = - 1.9 A (see fig. 12).  
c. ISD - 1.9 A, dI/dt 70 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91281  
S-Pending-Rev. A, 21-Jul-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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