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SIHFS11N50ATL-E3 PDF预览

SIHFS11N50ATL-E3

更新时间: 2024-10-18 06:11:43
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 990K
描述
Power MOSFET

SIHFS11N50ATL-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknown风险等级:5.09
Is Samacsys:N雪崩能效等级(Eas):275 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):11 A
最大漏极电流 (ID):11 A最大漏源导通电阻:0.52 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):170 W最大脉冲漏极电流 (IDM):44 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHFS11N50ATL-E3 数据手册

 浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第2页浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第3页浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第4页浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第5页浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第6页浏览型号SIHFS11N50ATL-E3的Datasheet PDF文件第7页 
IRFS11N50A, SiHFS11N50A  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
500  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.52  
RoHS*  
• Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
Qg (Max.) (nC)  
52  
13  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
• Fully  
Characterized  
Capacitance  
and  
18  
Avalanche Voltage and Current  
Configuration  
Single  
• Effective Coss Specified  
D
• Lead (Pb)-free Available  
D2PAK (TO-263)  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• High Speed Power Switching  
G
D
G
S
N-Channel MOSFET  
TYPICAL SMPS TOPOLOGIES  
• Two Transistor Forward  
S
• Half and Full Bridge  
• Power Factor Correction Boost  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRFS11N50APbF  
IRFS11N50ATRRPbFa  
SiHFS11N50ATR-E3a  
IRFS11N50ATRLPbFa  
SiHFS11N50ATL-E3a  
IRFS11N50ATRLa  
SiHFS11N50ATLa  
Lead (Pb)-free  
SiHFS11N50A-E3  
IRFS11N50A  
-
-
SnPb  
SiHFS11N50A  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
30  
Gate-Source Voltage  
VGS  
V
11  
TC = 25 °C  
TC =100°C  
Continuous Drain Current  
V
GS at 10 V  
ID  
7.0  
A
Pulsed Drain Currenta  
IDM  
44  
1.3  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
275  
11  
17  
EAR  
mJ  
W
170  
Maximum Power Dissipation  
T
C = 25 °C  
PD  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
V/ns  
6.9  
- 55 to + 150  
300d  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 19 mH, RG = 25 Ω, IAS = 5.5 A (see fig. 12).  
c. ISD 5.5 A, dI/dt 90 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91286  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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