IRFD110, SiHFD110
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
100
Available
• Repetitive Avalanche Rated
• For Automatic Insertion
R
DS(on) (Ω)
VGS = 10 V
0.54
RoHS*
Qg (Max.) (nC)
8.3
2.3
COMPLIANT
• End Stackable
Q
Q
gs (nC)
gd (nC)
3.8
• 175 °C Operating Temperature
• Fast Switching and Ease of Paralleling
• Lead (Pb)-free Available
Configuration
Single
D
HEXDIP
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The 4 pin DIP package is a low cost machine-insertable case
style which can be stacked in multiple combinations on
standard 0.1" pin centers. The dual drain serves as a thermal
link to the mounting surface for power dissipation levels up to
1 W.
G
S
G
D
S
N-Channel MOSFET
ORDERING INFORMATION
Package
HEXDIP
IRFD110PbF
SiHFD110-E3
IRFD110
Lead (Pb)-free
SnPb
SiHFD110
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
100
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
TC = 25 °C
TC =100°C
1.0
Continuous Drain Current
VGS at 10 V
ID
0.71
8.0
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.0083
140
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
1.0
EAR
0.13
mJ
W
Maximum Power Dissipation
T
C = 25 °C
PD
1.3
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
5.5
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 175
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 52 mH, RG = 25 Ω, IAS = 2.0 A (see fig. 12).
c. ISD ≤ 5.6 A, dI/dt ≤ 75 A/µs, VDD ≤ VDS, TJ ≤ 175 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91127
S-81263-Rev. A, 21-Jul-08
www.vishay.com
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