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SIHFBE30STL-E3 PDF预览

SIHFBE30STL-E3

更新时间: 2024-11-24 06:11:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 1204K
描述
Power MOSFET

SIHFBE30STL-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknown风险等级:5.26
其他特性:AVALANCHE RATED雪崩能效等级(Eas):260 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:800 V最大漏极电流 (Abs) (ID):4.1 A
最大漏极电流 (ID):4.1 A最大漏源导通电阻:3 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W最大脉冲漏极电流 (IDM):16 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICON

SIHFBE30STL-E3 数据手册

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IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
800  
Available  
• Repetitive Avalanche Rated  
• Fast Switching  
R
DS(on) (Ω)  
VGS = 10 V  
3.0  
RoHS*  
Qg (Max.) (nC)  
78  
9.6  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
• Ease of Paralleling  
45  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
Configuration  
Single  
D
D2PAK  
I2PAK  
(TO-263)  
(TO-262)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
G
D
S
S
D
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
I2PAK (TO-262)  
IRFBE30SPbF  
IRFBE30STRLPbFa  
SiHFBE30STL-E3a  
IRFBE30LPbF  
Lead (Pb)-free  
SiHFBE30S-E3  
IRFBE30S  
SiHFBE30L-E3  
-
-
-
-
SnPb  
SiHFBE30S  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
800  
20  
V
VGS  
T
C = 25 °C  
4.1  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC =100°C  
2.6  
Pulsed Drain Currenta  
IDM  
16  
Linear Derating Factor  
1.0  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
260  
4.1  
Repetitive Avalanche Energya  
EAR  
13  
mJ  
W
Maximum Power Dissipation  
Peak Diode Recovery dV/dtc  
T
C = 25 °C  
PD  
125  
2.0  
dV/dt  
TJ, Tstg  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
6-32 or M3 screw  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 29 mH, RG = 25 Ω, IAS = 4.1 A (see fig. 12).  
c. ISD 4.1 A, dI/dt 100 A/µs, VDD 600 V, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91119  
S-81432-Rev. A, 07-Jul-08  
www.vishay.com  
1

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