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SIHF9Z24STL-E3 PDF预览

SIHF9Z24STL-E3

更新时间: 2024-11-24 06:11:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 2304K
描述
Power MOSFET

SIHF9Z24STL-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.08
其他特性:AVALANCHE RATED雪崩能效等级(Eas):240 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):11 A
最大漏极电流 (ID):11 A最大漏源导通电阻:0.28 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):60 W最大脉冲漏极电流 (IDM):44 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHF9Z24STL-E3 数据手册

 浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第2页浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第3页浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第4页浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第5页浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第6页浏览型号SIHF9Z24STL-E3的Datasheet PDF文件第7页 
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Advanced Process Technology  
PRODUCT SUMMARY  
VDS (V)  
- 60  
Available  
• Surface Mount (IRF9Z24S/SiHF9Z24S)  
RDS(on) (Ω)  
VGS = - 10 V  
0.28  
Low-Profile Through-Hole (IRF9Z24L/SiHF9Z24L)  
RoHS*  
Qg (Max.) (nC)  
19  
5.4  
COMPLIANT  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
11  
• P-Channel  
Configuration  
Single  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
S
DESCRIPTION  
D2PAK (TO-263)  
I2PAK (TO-262)  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
G
G
D
S
D
P-Channel MOSFET  
The D2PAK is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in  
any existing surface mount package. The D2PAK is suitable  
for high current applications because of its low internal  
connection resistance and can dissipate up to 2.0 W in a  
typical surface mount application.  
The through-hole version (IR9Z24L/SiH9Z24L) is available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRF9Z24STRRPbFa  
SiHF9Z24STR-E3a  
IRF9Z24STRRa  
I2PAK (TO-262)  
IRF9Z24LPbF  
SiHF9Z24L-E3  
IRF9Z24L  
IRF9Z24SPbF  
SiHF9Z24S-E3  
IRF9Z24S  
IRF9Z24STRLPbFa  
SiHF9Z24STL-E3a  
IRF9Z24STRLa  
Lead (Pb)-free  
SnPb  
SiHF9Z24S  
SiHF9Z24STLa  
SiHF9Z24STRa  
SiHF9Z24L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 60  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
- 11  
- 7.7  
- 44  
0.40  
240  
- 11  
6.0  
Continuous Drain Currente  
VGS at - 10 V  
ID  
A
Pulsed Drain Currenta, e  
IDM  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb, e  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
EAR  
mJ  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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