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SI5458DU

更新时间: 2024-11-05 09:25:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 157K
描述
N-Channel 30-V (D-S) MOSFET

SI5458DU 数据手册

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New Product  
Si5458DU  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)d, e  
Definition  
TrenchFET® Power MOSFET  
100 % Rg Tested  
0.041 at VGS = 10 V  
0.051 at VGS = 4.5 V  
6
6
30  
2.8 nC  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
PowerPAK® ChipFET Single  
Load Switch  
HDD DC/DC  
1
2
D
D
3
(1, 2, 3, 6, 7, 8)  
D
D
4
D
D
8
G
Marking Code  
AP XXX  
D
7
S
6
S
Lot Traceability  
and Date Code  
G
5
(4)  
Part # Code  
(5)  
Bottom View  
Ordering Information: Si5458DU-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
30  
Unit  
V
20  
6e  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
6e  
Continuous Drain Current (TJ = 150 °C)  
ID  
6a, b, e  
6a, b, e  
20  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
6
Continuous Source-Drain Diode Current  
2.9a, b  
10.4  
6.7  
T
A = 25 °C  
TC = 25 °C  
C = 70 °C  
T
Maximum Power Dissipation  
PD  
W
3.5a, b  
2.2a, b  
TA = 25 °C  
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)f, g  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
30  
Maximum  
Unit  
Maximum Junction-to-Ambienta, c  
Maximum Junction-to-Case (Drain)  
t 5 s  
Steady State  
36  
12  
°C/W  
10  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 5 s.  
c. Maximum under steady state conditions is 72 °C/W.  
d. Based on TC = 25 °C.  
e. Package limited.  
f. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 65019  
S09-1392-Rev. A, 20-Jul-09  
www.vishay.com  
1

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